EEE faculty member Professor Tan Chuan Seng has been elevated to the grade of IEEE Fellow effective January 1, 2022. IEEE Fellowship is the highest grade of membership in the IEEE. Conferred by the IEEE Board of Directors, it is widely regarded by the technical community to be a prestigious honor and an important professional achievement.
Professor Tan is recognised for contributions to wafer bonding technology for 3D packaging and integration. He is best known for his pioneering work on low temperature wafer bonding, most notably on solder-less/bump-less copper bonding which is the ultimate solution for high density 3D chip stacking. This technology breaks the scaling barrier of conventional solder micro-bump to <10 micro-meter pitch. It is now pursued and used in products that require high bandwidth and low power consumption chip to chip connections. Major semiconductor companies such as Intel and AMD (through its foundry partner TSMC) will use this technology in their next generation products.
Professor Tan is a recipient of the Exceptional Technical Achievement Award from the IEEE Electronics Packaging Society (EPS) in 2019. He is a Distinguished Lecturer with IEEE-EPS and an Associate Editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology (he was recognized with the Best Associate Editor Award in 2021). He serves as an elected Member-at-Large to the IEEE-EPS Board of Governors from 2022-2024. In addition, he is a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) since 2019 and a recipient of the William D. Ashman - John A. Wagnon Technical Achievement Award in 2020.IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Each year, following a rigorous evaluation procedure, the IEEE Fellow Committee recommends a select group of recipients for elevation to IEEE Fellow. Less than 0.1% of voting members are selected annually for this member grade elevation.