- At least a good relevant bachelor's degree
- Relevant working experience is an advantage
- For applicants whose native language is not English, TOEFL/IELTS score is to be submitted with the application for admission:
TOEFL Score (Test dates must be within 2 years or less from the date of application):
≥ 600 (paper-based)
≥ 250 (computer-based)
≥ 100 (internet-based)
IELTS Score (Test date must be within 2 years or less from the date of application):
There are two options of study, one with coursework and dissertation, and the other with coursework only. Each course is of 3 AUs and consists of 39 hours of lectures. Candidates who undertake a project of 6 AUs must submit a dissertation on it.
|8 courses + dissertation project
(30 AUs in total)
(30 AUs in total)
|4 specialized electives (≥ 12 AUs)||4 specialized electives ((≥ 12 AUs)|
|4 general electives (≤ 12 AUs)||6 general electives (≤ 18 AUs)|
|Dissertation (6 AUs)|
Full-time students are strongly recommended to select the dissertation option, however this option is recommended only for students with a high level of English proficiency. Students taking the dissertation option may take a longer time to complete the programme.
Note: The programme structure will be subject to change without prior notice.
Both full-time and part-time programmes are offered (unless stated). Part-time candidates are expected to obtain permission from their employer before admission to the programme. All classes are conducted in the evenings, while ex aminations are conducted during office hours.
Type of Coursework Programme
|Master of Science
|1 year||3 year|
|Master of Science
|2 year||4 year|
|Semester 1||August to December|
|Semester 2||January to May|
|Week 1 to 14||Lecture (Inclusive of 1-week recess)|
|Week 15 to 17||Examinations|
Graduate courses offered by Master of Science (MSc) Electronics:
Specialized Elective Courses (Students are required to take a min of 4 out of all the 5 specialized elective courses)
|Course Code||Course Title||Course Content||AUs|
|EE6306||Digital Integrated Circuit (IC) Design||Review of Integrated Circuit Fundamentals. Layout and Design Issues. CMOS Digital Circuits. BiCMOS Digital Circuits. Sub System Design in Digital Circuits. Design Methodologies.||3|
|EE6307||Analog IC design||Review of Fundamentals. Analog Building Blocks. Switched Capacitor Circuits. Current Mode Circuits. Continuous-Time Filters. Data Converters.||3|
|EE6601||Advanced Wafer Processing||Dielectrics for CMOS technology. Chemical and mechanical polishing. Lithography and resist technology. Etching process and technology. Backend interconnect technology. Cleaning technology. Process integration. Metrology and analytical techniques.||3|
|EE6604||Advanced Topics in Semiconductor Devices||Bipolar transistor operating principles. Bipolar device modeling. State-of-the-art bipolar structures. MOS device operation. MOSFET modeling. MOS device scaling effects. Semiconductor memories. Semiconductor heterojunctions and devices. New devices and future trends.||3|
|EE6610||Integrated Circuit (IC) Packaging|
Overview of IC & microsystems package. Design of IC Package. Thermal Management of IC Package. Fabrication of Single Chip and Multichip
Package. IC Assembly, Sealing and Encapsulation. Failure Analysis and Reliability. Microsystems Package and Fabrication. System Level Package and Fabrication.
General Elective Courses
|Course Code||Course Title||Course Content||AUs|
|EE6010||Project Management & Technopreneurship||Project Initiation and Planning. Project Scheduling and Implementation. Project Monitoring, Control and Evaluation. Innovation and Entrepreneurship.||3|
|EE6102||Cyber Security and Blockchain Technology||Cyber Security Threat Landscape, Industry 4.0 and Cyber Security, Cyber Security Education, Awareness and Compliance, Cyber Security Planning, Policies and Compliance, Cyber Security Risk Assessments and Biometric-based Security approaches, Public key Infrastructure (PKI), Web Security and role of firewalls and Intrusion Detection, Online Payment, and Cryptocurrencies. Basics of Blockchain technology, Types of blockchain Technology, Blockchain Technology Applications for Industry 4.0, use cases and real-world case studies||3|
|EE6128||RF Circuits for Wireless Communications||Microstrip Line and Network Parameters. Microwave Power Dividers and couplers. Microwave Filters. Amplifiers. Oscillators and Synthesizers. Detectors and Mixers. Frequency Multipliers and Control Circuits. RF Receiver Design.||3|
|EE6227||Genetic Algorithms and Machine Learning||Review of Combinatorics and Probability. Introduction of Genetic Algorithms. Differential Evolution. Particle Swarm Optimization. Advanced Techniques. Principles of Machine Learning. Paradigms of Machine Learning. Kernel Methods.||3|
|EE6301||Smart Biosensors and Systems for Healthcare||Introduction to biosensors and healthcare; Optical biosensors-fundamentals; Optical biosensors-applications; Biomedical imaging with optical technologies; Introduction to electrical biosensors- fundamentals; Introduction to electrical biosensors- fabrications; Applications of electrical biosensor; Introduction to bio-intelligent systems; Artificial intelligence in medical sensing and imaging||3|
|EE6303||Electromagnetic Compatibility Design||EMC Regulatory Requirements. Non-Ideal Behaviors of Passive Components. Conducted EMI and Filter Design. Electromagnetic Shielding. Basic Grounding Concept. Crosstalk. Printed Circuit Board Layout and Radiated EMI. Electrostatic Discharge. Radio Frequency Interference. Emission and Susceptibility Measurement Methods.||3|
|EE6506||Power Semiconductor Based Converter in Renewable Energy Systems||Module 1: Overview of power electronic circuits and semiconductor devices, Module 2: Power diodes and thyristors as switching devices, Module 3: Power transistors as switching devices 2, Module 4: Protection of devices from overheating di/dt, dv/dt, Module 5: Passive components and magnetics, Module 6: Renewable energy systems||3|
|EE6808||LED Lighting and Display Technologies|
Review of optoelectronic processes and optics. Review of solid state lighting and display technologies. Light-emitting diodes. Plasma display panels. Field emission displays. Liquid crystal displays. Organic light-emitting
device. Thin film transistors and active-matrix backplane circuits. AC thin film
electroluminescent displays and printed electrochromic displays.
|EE7602||Integrated Circuit Technology||Overview of Electronic Devices. Electronic Device Fabrication. Small Geometry Effects, Device Scaling and Advanced Nanoscale CMOS Devices. Latchup and ESD Protection in CMOS Technology. Failure Mechanisms of Integrated Circuits||3|
|EE7603||Semiconductor Physics and Applications||Review of Fundamentals; Energy Bands of Semiconductors; Doping and Carrier Concentrations; Physics of Low Dimensional Systems; Electrical Transport Phenomena and Working principles and designs of nanoelectronic devices; Excess Carriers; Optical Properties and Photonic Devices.||3|
|EE7608||Advanced Engineering of Optoelectronics||Fundamental concepts. Electron spectrometrics. Phonon and photon spectrometrics. Applications. 2D materials and interfaces. Metamaterials and plasmonics.||3|
Note: the above curriculum is subject to change.
Five MSc programmes (Communications Engineering, Computer Control & Automation, Electronics, Power Engineering and Signal Processing) are self-financed programmes.
Students of these programmes are not eligible for Service Obligation/ MOE Subsidies.
The tuition fees per module (3 AUs) and per dissertation (6 AUs) for admission from AY2020 onwards are shown in the table as follows:
|Singaporeans (SC)||Singapore PRs (SPR)||International Students (IS)|
|Per Module||Per Dissertation^||Per Module||Per Dissertation^||Per Module||Per Dissertation^|
|Minimum Total Programme Fee||Minimum Total Programme Fee||Minimum Total Programme Fee|
*Inclusive of GST
^The tuition fee for the Dissertation (6 AUs) will be twice of each module fee.
All fees listed above are in Singapore dollars (S$) and subject to annual revision by the school. The tuition fee is exclusive of living expenses and miscellaneous student fees.
The deposit fee of S$2,000 is payable upon acceptance of the offer and is non-refundable. It will be deducted from the full tuition fee.
Awards in MSc Programme
|Awards Title||Awards Description|
|IEEE PHOTONICS & SOCIETY SINGAPORE CHAPTER & THE OPTICAL SOCIETY (OSA)||The Prize (cash award) is awarded to the student with the highest mark in the course EE6122 (Optical Fibre Communications).|
|MICRON GOLD MEDAL||The medal is awarded to the best graduating student with highest aggregate marks in the degree of Master of Science (Electronics) and who has completed the programme within 2 years.|
|PROFESSIONAL ENGINEERS BOARD GOLD MEDAL|
The medal is awarded to the graduating student with the highest average marks in the coursework component and who had completed the programme offered by the School of EEE.
The awardees are required to have their first degree from the respective prescribed programmes.
|TEXAS INSTRUMENTS BOOK PRIZE||The book prize (cash award) is awarded to the student with the highest mark in the course EE6402 (Real-time DSP Design and Applications).|