Ms Lien Siaou-Sze (seated, left), NTU Vice President for University Advancement, and Ms Lin Su-Lin, Vice-Chairman and Co-Founder of Hermes-Epitek Corporation, at the gift signing ceremony witnessed by College of Engineering Dean Prof Louis Phee (standing, left) and Chairman and Founder of Hermes-Epitek Corporation Mr Archie Hwang.
As Singapore’s semiconductor industry continues to grow, it has become increasingly important to train engineers and technicians who are equipped to join it.
Recognising the value of providing sustainable support for engineering students at NTU, Hermes-Epitek Corporation Pte Ltd has recently partnered with the University to establish the Hermes-Epitek Innovation Undergraduate and Postgraduate Scholarships.
Made possible through an endowed gift of S$1.15m from the corporation, the scholarships will benefit undergraduates and postgraduates who have demonstrated strong academic results and are students in the fields of Electrical & Electronic Engineering, Mechanical and Aerospace Engineering, Materials Science and Engineering, and Computer Science and Engineering.
The Hermes-Epitek Undergraduate Scholarship will support up to two awards of S$8,000 annually while the Postgraduate Scholarship will support one award of up to S$45,000 annually.
Praising the vision of Hermes-Epitek in setting up the scholarships, Ms Lien Siaou-Sze, NTU’s Vice President for University Advancement said: “NTU is committed to ensuring an inspiring and transformative educational experience for our students. With like-minded partners like Hermes-Epitek Corporation, the University can continue to provide recognition and opportunities for our most able engineering students.”
About Hermes-Epitek Corporation Pte Ptd
Established in 1992, Hermes-Epitek Corporation is one of the world’s largest high-tech equipment distributors with over 1,000 employees worldwide. It provides state-of-the-art equipment and product line integration synergies. Its products include semiconductor equipment, flat panel displays, ion implanters, furnaces, and ancillary materials.