4th International Conference on 3D Construction Printing

This 4th International Conference on 3D Construction Printing (4-IC3DcP) is scheduled to be held on 19-21 July 2023 at Nanyang Technological University (NTU, Singapore). This follows the inaugural one held at Swinburne University of Technology in Melbourne (Australia) in November 2018, the 2nd one held at Hebei University of Technology in Tianjin in October 2019 and the 3rd conference held online in June 2022 and mainly organized by TongJi University, Shanghai. Separately, in May 2021, Southeast University (Nanjing) organized an International Conference on 3D Printing Concrete Materials and Structures held online.

We welcome all participants back to a physical format, in July 2023, and hope to rekindle all ties, networks, cooperation and relationships in our very special community; and trying to spearhead change in an important industry, viz. Construction. We would also like to promote collaborations between the scientific communities and industries, share our achievements and make significant progress in all our endeavors.

The Scope of the conference covers all aspects of Construction 3D Printing, to include established technology, modeling, simulation, materials, recycled materials and concrete, geopolymer, fiber reinforcement and composite materials, testing and standards, applications, Building Information Modeling (BIM), design, optimization, structural and intelligent monitoring, robotics and automation.

The organizers will publish all accepted papers in a Special Issue by Springer titled: 3D Printing in Building & Construction.


3DCP timeline

New Deadlines:

Full Paper (Maximum 8 pages, for publication in Springer Book series) :  19 July 2023

Abstract deadline (for presentation only) : 12 July 2023




Conference Chairs

Paulo Bartolo

Nanyang Technological University, Singapore

Tan Ming Jen

Nanyang Technological University, Singapore

Wong Teck Neng

Nanyang Technological University, Singapore

Organizing Committee

Adeline Tan (SC3DP, NTU)Li Mingyang (SC3DP, NTU)
Caroline Fok (SC3DP, NTU)Lim Jian Hui (SC3DP, NTU)
Chaw Peiwei (SC3DP, NTU)Lu Bing (SC3DP, NTU)
Cyberia Lim (SC3DP, NTU)Sangeetha Sreekamal (SC3DP, NTU)
Daniel Tay (SC3DP,NTU)Shum Chee Wai (SC3DP, NTU)
Henry Herng (SC3DP, NTU)Tommy Francis (SC3DP, NTU)
Jessie Tee (SC3DP, NTU)Wang Lining (SC3DP, NTU)

International Scientific Committee

Berok Khoshnevis - University of Southern California, USAMichael Fiske - Jacob Space/NASA Marshall
Biranchi Panda - Indian Institute of Technology Guwahati, IndiaRichard Buswell  - Loughborough University, UK
Erik Schlangen - Delft University of Technology, NetherlandsStephan Mansour - Wohlers Associates, USA
Jay Sanjayan - Swinburne University of Technology, AustraliaTheo Salat - Eindhoven University of Technology, Netherlands
Jianzhuang Xiao - Tongji University, ChinaTimothy Wangler - ETH Zurich, Switzerland
Liu Alexander - ASTM InternationalVittoria Laghi - Massachusetts Institute of Technology (MIT), USA
Liew Kim Meow - City University of Hong Kong, Hong kongVictor Mechtcherine - TU Dresden
Ma Guowei - Hebei University of Technology, ChinaWeng Yiwei - Hong Kong Polytechnic University, Hong Kong
 Yamei Zhang - Southeast University, China


Supported By



The Arc - Learning Hub North, 63 Nanyang Drive, Singapore, 636922 Map