Research Capabilities

Discover the capabilities of our cleanrooms and how we can help you with your research. 

Cleanroom 1 & 2

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The available process modules in CR1/CR2 include the following:

  • Thin Film Module - Plasma Enhanced Chemical Vapour Deposition (PECVD), Physical Vapour Deposition (PVD), Ebeam Evaporation and Rapid Thermal Processing equipment, High Density Plasma Chemical Vapor Deposition (HDP CVD) and Low Pressure Chemical Vapor Deposition (LPCVD).
  • Diffusion Module - Diffusion Furnaces, Drive-in and Ion Implanation equipment, Rapid Thermal Annealing.
  • Dry Etch Module - Reactive Ion Etch (RIE), Inductive-Coupled Plasma (ICP)-RIE, Deep Silicon RIE equipment and Photoresist Asher, Descum and Dry Stripper.
  • Lithography Module - Coater, Mask Aligner, Developer and Hotplate oven, Electron Beam Lithography, Priming Oven and Resist Spin Coaters.​.
  • Wet Bench Module - Wet bench, Megasonic bench and IPA dryer
  • Metrology Module - Optical Microscope, Stress measurement, Resistivity measurement, Step Profiler, Interferometer and Ellipsometer, Field Emission Scanning Electron Microscope (FESEM), Atomic Force Microscope (AFM), Ellipsometer and X-Ray Diffractometer.
  • Packaging and Dicing Module - Wire bonding and Wafer dicing​.