Research Capabilities

Discover the capabilities of our cleanrooms and how we can help you with your research. 

Cleanroom 1

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The available process modules in CR1 include the following:

  • Thin Film Module - Plasma Enhanced Chemical Vapour Deposition (PECVD), Physical Vapour Deposition (PVD), Ebeam Evaporation and Rapid Thermal Processing equipment.
  • Diffusion Module - Diffusion Furnaces, Drive-in and Ion Implanation equipment.
  • Dry Etch Module - Reactive Ion Etch (RIE), Inductive-Coupled Plasma (ICP)-RIE, Deep Silicon RIE equipment and Photoresist Asher.
  • Lithography Module - Coater, Mask Aligner, Developer and Hotplate oven.
  • Wet Bench Module - Wet bench, Megasonic bench and IPA dryer
  • Metrology Module - Scanning Electron Microscopy (SEM), Optical Microscope, Stress measurement, Resistivity measurement, Step Profiler, Interferometer and Ellipsometer.
  • Packaging and Dicing Module - Wire bonding and Wafer dicing​.

Cleanroom 2

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The available process modules in C2 include the following:

  • Thin Film Module - Physical Vapor Deposition (PVD), E-Beam Evaporation, Metal Organic Chemical Vapor Deposition (MOCVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma Chemical Vapor Deposition (HDP CVD) and Low Pressure Chemical Vapor Deposition (LPCVD).
  • Diffusion Module - Rapid Thermal Annealing.
  • ​Dry Etch Module - Reactive Ion Etch (RIE), Inductive-Coupled Plasma (ICP), Descum and Dry Stripper.
  • ​Wet Bench Module - Acid & Solvent Benches and Fumehood.
  • Lithography Module - Electron Beam Lithography, Mask Aligner, Priming Oven and Resist Spin Coaters.​
  • Metrology - Field Emission Scanning Electron Microscope (FESEM), Atomic Force Microscope (AFM), Step Profiler, Ellipsometer and X-Ray Diffractometer.