CET771 Integrated Circuit (IC) Packaging III

Course Provider

School of Electrical and Electronic Engineering (EEE)



Academic Unit



The objective of the course is to focus on the fundamental principles underlying the core technology of IC and microsystem packaging. It aims to enhance learners understanding in IC and microsystem packaging design, fabrication, characterization and other applications.

This course is part of:

- Graduate Certificate in Electronics
- FlexiMasters in Electronics

Download Learning Pathway e-Guide


At the end of the course, learners  are able to:

1. Understand the fundamentals of IC assembly and packaging;

2. Understand the fundamentals of encapsulations and sealing;

3. Understand the fundamentals of single chip packages and Multichip Module (MCM) design, fabrication and testing and;

4. Able to design failure modes and failure analysis.

IC Assembly, Sealing and Encapsulation

IC Assembly. Wire bonding and Tape Automated Bonding (TAB). Flip chip and flip chip processing. Encapsulants and sealing processes.

Single Chip and Multichip Package

Single chip package and different methods. Multichip Module (MCM) and different methods. System level MCM package.

Failure Analysis and Reliability

Reliability metrology and qualifications. Failure modes and mechanisms. Reliability tests and analysis. Failure analysis and prediction.

For graduates, practicing engineers, R&D managers and technical staff who wish to gain in-depth technical knowledge in the area of semiconductor manufacture and microelectronics.

Standard Course Fee: S$1,635

SSG Funding Support

 Course fee

Course fee payable after SSG funding, if eligible under various schemes


BEFORE funding & GST

AFTER funding & 9% GST

Singapore Citizens (SCs) and Permanent Residents (PRs) (Up to 70% funding)



Enhanced Training Support for SMEs (ETSS)


SCs aged ≥ 40 years old
SkillsFuture Mid-career Enhanced Subsidy (MCES)
(Up to 90% funding)

  • Standard course fee is inclusive of GST.
  • NTU/NIE alumni may utilise their $1,600 Alumni Course Credits. Click here for more information.


Read more about funding
CET757 Digital Integrated Circuit Design I1
CET758 Digital Integrated Circuit Design II1
CET759 Digital Integrated Circuit Design III1
CET760 Advanced Topics in Semiconductor Devices I1
CET761 Advanced Topics in Semiconductor Devices II1
CET762 Advanced Topics in Semiconductor Devices III1
CET763 Advanced Wafer Processing I1
CET764 Advanced Wafer Processing II1
CET765 Lithography Processes for Next Generation of Nano Scale Smart Devices1
CET766 Analog Integrated Circuit Design I1
CET767 Analog Integrated Circuit Design II1
CET768 Analog Integrated Circuit Design III1
CET769 Integrated Circuit (IC) Packaging I1
CET770 Integrated Circuit (IC) Packaging II1

Listed courses are:

  • Credit-bearing and stackable to Graduate Certificate in Electronics (total 9AUs) and FlexiMasters in Electronics (total 15AUs).
  • SSG funded and SkillsFuture Credit approved.