CET769 Integrated Circuit (IC) Packaging I

Course Provider

School of Electrical and Electronic Engineering (EEE)



Academic Unit



The objective of the course is to focus on the fundamental principles underlying the core technology of IC and microsystem packaging. It aims to enhance learners understanding in IC and microsystem packaging design, fabrication, characterization and other applications.

This course is part of:

- Graduate Certificate in Electronics
- FlexiMasters in Electronics


Download Learning Pathway e-Guide


At the end of the course, learners  are able to:

1. Understand the fundamentals of electronic chip package design;

2. Understand electrical design for signal and power distribution;

3. Understand material properties with design and fabrication and;

4. Able to design and thermal analyze IC package using different electronic cooling methods and solutions for advanced packaging.

Introduction of IC and Microsystem Packaging

IC and microsystems. Microelectronics packaging, Microsystem packaging. IC packaging and Kent equation. Different types of IC packaging and methods.

Design of Electrical Package

IC package design. Signal and power distribution. Electrical design process. Electrical testing methods

Packaging Material and Thermal Management

Different electronical material properties. Thin film and thick film fabrication processes. Thermal management models: conduction, convection and radiation. Thermal simulation and analysis. Different cooling methods.

For graduates, practicing engineers, R&D managers and technical staff who wish to gain in-depth technical knowledge in the area of semiconductor manufacture and microelectronics.

Standard Course Fee: S$1,635

SSG Funding Support

 Course fee

Course fee payable after SSG funding, if eligible under various schemes


BEFORE funding & GST

AFTER funding & 9% GST

Singapore Citizens (SCs) and Permanent Residents (PRs) (Up to 70% funding)



Enhanced Training Support for SMEs (ETSS)


SCs aged ≥ 40 years old
SkillsFuture Mid-career Enhanced Subsidy (MCES)
(Up to 90% funding)

  • Standard course fee is inclusive of GST.
  • NTU/NIE alumni may utilise their $1,600 Alumni Course Credits. Click here for more information.


Read more about funding
CET757 Digital Integrated Circuit Design I1
CET758 Digital Integrated Circuit Design II1
CET759 Digital Integrated Circuit Design III1
CET760 Advanced Topics in Semiconductor Devices I1
CET761 Advanced Topics in Semiconductor Devices II1
CET762 Advanced Topics in Semiconductor Devices III1
CET763 Advanced Wafer Processing I1
CET764 Advanced Wafer Processing II1
CET765 Lithography Processes for Next Generation of Nano Scale Smart Devices1
CET766 Analog Integrated Circuit Design I1
CET767 Analog Integrated Circuit Design II1
CET768 Analog Integrated Circuit Design III1
CET770 Integrated Circuit (IC) Packaging II1
CET771 Integrated Circuit (IC) Packaging III1

Listed courses are:

  • Credit-bearing and stackable to Graduate Certificate in Electronics (total 9AUs) and FlexiMasters in Electronics (total 15AUs).
  • SSG funded and SkillsFuture Credit approved.