CET763 Advanced Wafer Processing I

Course Provider

School of Electrical and Electronic Engineering (EEE)

Certification

FlexiMasters

Academic Unit

1

Introduction

The objective of the course is to study the process development and integration related to etching, back-end interconnects which are essential in CMOS IC manufacturing.

This course is part of:

- Graduate Certificate in Electronics
- FlexiMasters in Electronics


At the end of the course, learners  are able to:

1. Expose to legacy and state-of-the-art CMOS technologies;

2. Understanding of the etching mechanism, design of plasma etching system and process requirements;

3. Appreciation of transition from Al to Cu interconnects, and emerging 3D interconnects and;

4. Understanding of the full CMOS flows and requirements.

Etching Process and Technology

- Wet etching
- Dry/Plasma Etching
- Models
- Challenges

Interconnect Technology

- Cu Electro-plating
- Damascene
- Interconnect Scaling
- 3DIC

Process Integration Isolation

- Contact. Shallow Junctions
- Slicides
- CMOS Process Integration
- Scaling

For graduates, practicing engineers, R&D managers and technical staff who wish to gain in-depth technical knowledge in the area of semiconductor manufacture and microelectronics.

Standard Course Fee: S$1,605

Course fee payable after SSG funding, if eligible under various schemes

Cat-A SSG Funded Courses

S$481.50

Enhanced Training Support for SMEs (ETSS) 

S$181.50

Mid-Career Enhanced Subsidy (MCES)

S$181.50
  • All fees stated are inclusive of 7% GST.
  • NTU/NIE alumni may utilise their $1,600 Alumni Course Credits. Click  here for more information. 
    Read more about funding
    COURSE TITLEACADEMIC UNIT
    CET757 Digital Integrated Circuit Design I1
    CET758 Digital Integrated Circuit Design II1
    CET759 Digital Integrated Circuit Design III1
    CET760 Advanced Topics in Semiconductor Devices I1
    CET761 Advanced Topics in Semiconductor Devices II1
    CET762 Advanced Topics in Semiconductor Devices III1
    CET764 Advanced Wafer Processing II1
    CET765 Lithography Processes for Next Generation of Nano Scale Smart Devices1
    CET766 Analog Integrated Circuit Design I1
    CET767 Analog Integrated Circuit Design II1
    CET768 Analog Integrated Circuit Design III1
    CET769 Integrated Circuit (IC) Packaging I1
    CET770 Integrated Circuit (IC) Packaging II1
    CET771 Integrated Circuit (IC) Packaging III1

    Listed courses are:

    • Credit-bearing and stackable to Graduate Certificate in Electronics (total 9AUs) and FlexiMasters in Electronics (total 15AUs).
    • SSG funded and SkillsFuture Credit approved.