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Introduction
The objective of the course is to study the process development and integration related to etching, back-end interconnects which are essential in CMOS IC manufacturing.
- Graduate Certificate in Electronics
- FlexiMasters in Electronics
Download Learning Pathway e-Guide
At the end of the course, learners are able to:
1. Expose to legacy and state-of-the-art CMOS technologies;
2. Understanding of the etching mechanism, design of plasma etching system and process requirements;
3. Appreciation of transition from Al to Cu interconnects, and emerging 3D interconnects and;
4. Understanding of the full CMOS flows and requirements.
Etching Process and Technology
- Wet etching
- Dry/Plasma Etching
- Models
- Challenges
Interconnect Technology
- Cu Electro-plating
- Damascene
- Interconnect Scaling
- 3DIC
Process Integration Isolation
- Contact. Shallow Junctions
- Slicides
- CMOS Process Integration
- Scaling
For graduates, practicing engineers, R&D managers and technical staff who wish to gain in-depth technical knowledge in the area of semiconductor manufacture and microelectronics.
Standard Course Fee: S$1,635
SSG Funding Support | Course fee | Course fee payable after SSG funding, if eligible under various schemes | |
BEFORE funding & GST | AFTER funding & 9% GST | ||
Singapore Citizens (SCs) and Permanent Residents (PRs) (Up to 70% funding) | S$1,500 | S$490.50 | |
Enhanced Training Support for SMEs (ETSS) | S$190.50 | ||
SCs aged ≥ 40 years old | |||
- Standard course fee is inclusive of GST.
- NTU/NIE alumni may utilise their $1,600 Alumni Course Credits. Click here for more information.
| COURSE TITLE | ACADEMIC UNIT |
| CET757 Digital Integrated Circuit Design I | 1 |
| CET758 Digital Integrated Circuit Design II | 1 |
| CET759 Digital Integrated Circuit Design III | 1 |
| CET760 Advanced Topics in Semiconductor Devices I | 1 |
| CET761 Advanced Topics in Semiconductor Devices II | 1 |
| CET762 Advanced Topics in Semiconductor Devices III | 1 |
| CET764 Advanced Wafer Processing II | 1 |
| CET765 Lithography Processes for Next Generation of Nano Scale Smart Devices | 1 |
| CET766 Analog Integrated Circuit Design I | 1 |
| CET767 Analog Integrated Circuit Design II | 1 |
| CET768 Analog Integrated Circuit Design III | 1 |
| CET769 Integrated Circuit (IC) Packaging I | 1 |
| CET770 Integrated Circuit (IC) Packaging II | 1 |
| CET771 Integrated Circuit (IC) Packaging III | 1 |
Listed courses are:
- Credit-bearing and stackable to Graduate Certificate in Electronics (total 9AUs) and FlexiMasters in Electronics (total 15AUs).
- SSG funded and SkillsFuture Credit approved.
