Published on 05 Jun 2023

Best Paper Award at ACM/IEEE ICCPS 2023

Photo of four awardees, two persons at the center holding a Best Paper Award.Team members (from left): Assoc Prof Tan Rui, Mr Chen Jiale, Dr Le Van Duc and Mr Daren Ho (HP Inc., Singapore).

The research team from HP-NTU Digital Manufacturing Corporate Lab, Mr Chen Jiale (Research Associate) and Dr Le Van Duc (Research Fellow) led by Assoc Prof Tan Rui from School of Computer Science and Engineering and Mr Daren Ho from HP Inc., Singapore won the Best Paper Award from the 14th ACM/IEEE International Conference on Cyber-Physical Systems (ICCPS) for the paper titled “BubCam: A Vision System for Automated Quality Inspection at Manufacturing Lines”. The award winner is selected from 21 accepted papers among 82 submissions by an award committee consisting of multiple distinguished senior members in the Cyber-Physical System (CPS) community. 

Diagram of a BubCam.

The team has designed and implemented a smart collaborative camera system for automated quality inspection of manufactured ink bags in HP Inc.'s factories in Singapore. The designed camera system uses various deep learning (DL)-based image segmentation and depth fusion techniques to achieve satisfactory inspection performance under the dynamic ambient light reflection condition of the industrial environment. The system is extensively evaluated via both controlled lab and factory experiment trials, and can obtain significant performance improvement, compared with the existing inspection approaches.

Paper information: 
BubCam: A Vision System for Automated Quality Inspection at Manufacturing Lines   
Jiale Chen, Duc Van Le, Rui Tan, Daren Ho   
Paper link:   

Conference information:
ACM/IEEE ICCPS is the premier forum for presenting and discussing the most significant recent technical research contributions in the field of CPS. It is a module conference of CPS-IoT Week 2023 which was held from 9 to 12 May 2023 in San Antonio, Texas, USA. 

Conference link: