Group facility

Thin film deposition:

1. UHV magnetron sputtering deposition system

2. Metal growth UHV molecular beam epitaxy system (developing, to be complete in June 2009 )

3. Riber Compact 21 UHV III-V semiconductor molecular beam epitaxy system

4. Pulsed electrodeposition system

Characterisation:

1. Magneto-optical Kerr magnetometry

2. MR measurement setup

3. Test and measurement probe station

Microfabrication:

1. Class 100-100k cleanroom

2. Acid and solvent chemical processing benches

3. Suss mask aligner MJB4

4. Nikon advanced optical microscope

5. Quorum Technology oxygen plasma barrel etcher

6. Edwards 306 thermal and e-beam evaporation system

Division central facility:

1. Veeco scanning probe microscope

2. JEOL scanning electron microscope

3. Bruker X-ray diffractometer

Magnetron Sputtering System

Riber Compact 21 III-V MBE System