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CHIP FABRICATION
CONFERENCES OF INTEREST
- Circuits -
ISSCC (International Solid-State Circuits Conference) (S: Sept., P: Feb.)
SOVC (Symposium on VLSI Circuits) (S: Jan., P: June)
CICC (Custom Integrated Circuits Conference) (S: April, P: Sept.)
ESSCIRC (European Solid-State Circuits Conference) (S: April, P: Sept.)
ASSCC (Asian Solid-State Circuits Conference) (S: June, P: Nov.)
ISLPED (International Symposium on Low Power Electronics and Design) (S: Mar., P: Aug.)
IRPS (International Reliability Physics Symposium) (S: Oct., P:April)
ISCAS (International Symposium on Circuits and Systems) (S: Oct., P: May)
3DIC (International 3D Systems Integration Conference) (S: Sept., P:Feb.)
- CAD -
DAC (Design Automation Conference) (S: Oct., P: June)
ASP-DAC (Asia and South Pacific Design Automation Conference) (S: Aug., P: Jan)
ICCAD (International Conference on Computer Aided Design) (S: May, P: Nov.)
Note: S and P represent 'Submission' and 'Presentation', respectively
JOURNALS OF INTEREST
JSSC (IEEE Journal of Solid-State Circuits)
TCAS I (IEEE Transactions on Circuits and Systems I)
TCAS II (IEEE Transactions on Circuits and Systems II)
TVLSI (IEEE Transactions on VLSI Systems)
TCAD (IEEE Transactions on Computer Aided Design)
© 2009 Tony Kim's Research Group S2.2-B2-52 School of EEE, Nanyang Technological University, Singapore