A PhD Scholarship to Offer
I have a PhD Scholarship for the Aug
12 intake. This scholarship must be used for a PhD research scholar
(Singapore citizen or SPR) to get a PhD in the research area of optical and
laser engineering (for example: machining, or fabrication or measurement or
application of optical materials/components/systems, etc, which can be
discussed and determined by you and me together). The PhD student can be
attached to Singapore Institute of Manufacturing Technology (SIMTech). If you
are or your friend is interested in taking this PhD Research Scholarship in
order to obtain a PhD degree, please let me know (E-mail : mzwzhong@ntu.edu.sg).
Who is
eligible?
You are
eligible for this scholarship if you are a local (Singapore citizen or SPR)
student seeking admission as a full-time candidate pursuing a Doctor of
Philosophy (Ph.D) programme
by research at NTU.
Eligibility
criteria
- You must have a First Class Honours or Second Class (Upper Division) Honours or its equivalent
- You should not be on paid employment or
accept paid employment or concurrently hold any other scholarship,
fellowship, bursary or top-up allowance during the prescribed period of
the award
Coverage
- The award is renewable for 4 years.
- In the first year, the monthly stipend
will be S$2,500 for Singapore Citizens, and S$2,200
for Singapore Permanent Residents.
- After the first year, for students who
pass the Year-1 Confirmation, the stipend may be increased to S$3,000 for
Singapore Citizens, and S$2,700 for Singapore
Permanent Residents.
- In addition to the monthly stipend, the
award also covers the annual tuition fee and the annual computer fee.
- The maximum period of the award is up to
four years for Ph.D. candidates.
Bond
There is
no bond attached to the scholarship.
Teaching opportunities
Upon year-1 confirmation of Ph.D.
candidature, students on scholarships will be given the opportunity to teach.
It will add value to their Curriculum Vitae, and provide valuable exposure
and experience for those who wish to pursue an academic career subsequently.
Conference support
One overseas conference support
(up to $3K) and one local conference support (up to $600) for this research
area on optical and laser engineering.
Whether you can view the full-text of a paper in the lists
depends on whether your institution has a subscription to the publisher (e.g.
Elsevier/ScienceDirect, Emerald, IEEE, SpringerLink,
NTU library has
subscriptions to the publishers.
If your institution like NTU library has a subscription to the publisher, you may
want to click the hyperlinked paper-title/words and use your authorized user ID
and password to login and view a paper in the lists.
Go back to my Home Page
Our
joint paper won The Best Application Paper Award at The
8th Asian Control Conference (ASCC 2011), 2011.
C.K. Pang, J.-H. Zhou, Z.-W. Zhong, F.L.
Lewis, (Invited Paper)
"Industrial Fault Detection and Isolation Using Dominant Feature
Identification," The 8th Asian Control Conference (ASCC 2011), Kaohsiung,
Taiwan, May 15-18, 2011, pp. 1018-1023.
My paper was the most frequently downloaded journal
article in Microelectronics Reliability during JAN - MAR 2011: Top
1
Z.W. Zhong, Overview
of wire bonding using copper wire or insulated wire, Microelectronics Reliability 51 (1)
(2011) 4-12.
Our papers have been ScienceDirect TOP Hottest Articles (most
frequently downloaded journal articles)
·
In Microelectronics Reliability: OCT
- DEC 2011: Top 6 JUL - SEP 2011:
Top 3 APR - JUN 2011: Top 5
JAN - MAR 2011:
Top
1 APR
- JUN 2008: Top
17 OCT - DEC 2007: Top
4, Top
15
JUL - SEP 2007:
Top
9, Top
22 APR - JUN 2007: Top
2, Top
16
JAN - MAR 2007:
Top
3, Top
7, Top
9 OCT
- DEC 2006: Top
2, Top
8
JUL - SEP 2006:
Top
3, Top
24 APR
- JUN 2006: Top
6, Top
21 JAN
- MAR 2006: Top
1
JUL - SEP 2005: Top
6 APR
- JUN 2005: Top
16 OCT
- DEC 2004: Top
19
· In International Journal of Engineering Science: OCT - DEC 2011: Top 10
·
In Measurement:
OCT
- DEC 2011: Top 25 JUL - SEP 2011: Top 7 APR
- JUN 2011: Top
16 JAN
- MAR 2011: Top
12 OCT 2009 –
SEP 2010 Academic Year: Top
7
OCT - DEC 2010: Top
12 JUL - SEP 2010: Top
11 APR
- JUN 2010: Top
7 JAN - MAR 2010: Top
12
OCT - DEC 2009: Top
11 JUL
- SEP 2009: Top
8 APR - JUN 2009: Top
13
OCT - DEC 2005: Top 13 JUL - SEP 2005: Top
11 APR
- JUN 2005: Top
3
· In Mechanism and Machine Theory JUL - SEP 2010: Top 14
·
In
Microelectronics Journal: OCT - DEC 2006: Top 19 APR - JUN 2006: Top
12 JAN
- MAR 2006: Top
4
OCT - DEC 2005: Top
21 JUL
- SEP 2005: Top
12 APR
- JUN 2005: Top
23
·
In Microelectronic
Engineering: OCT - DEC 2006: Top 22
·
In Sensors and Actuators A: Physical: JUL
- SEP 2007: Top
14 JAN - MAR 2007: Top
15
· In Materials Characterization: JAN - MAR 2008: Top 15 OCT - DEC 2007: Top 23 JUL - SEP 2007: Top 25
· In Physica A: JAN - MAR 2011: Top 13 APR - JUN 2008: Top 9
· In International Journal of Industrial Ergonomics: JAN - MAR 2009: Top 9 APR - JUN 2009: Top 6 JUL - SEP 2009: Top 10
· In Advanced Engineering Informatics: APR - JUN 2009: Top 4 JUL - SEP 2009: Top 23 OCT - DEC 2009: Top 25
Our papers have been the most
downloaded popular articles in Soldering & Surface
Mount Technology
Top
8, Top
11 during 2007; Top
10, Top
12 during 2007 (JAN-SEP 2007); Top
11, Top
20 during 2007 (JAN-JUN 2007); Top
16 during 2006
Top
8 since
2001 (monitoring began) to JAN 2008; Top
12 since 2001 (monitoring began) to OCT 2007; Top
15 since 2001 (monitoring began) to JUL 2007; Top
20 since 2001 (monitoring began) to MAR 2007
Top
20 by
Immediate Impact (updated in OCT 2007); Top
18 by Immediate Impact (updated in JUL 2007); Top
14 by Immediate Impact (updated in APR 2007)
Our paper has been the most
downloaded popular articles in Microelectronics
International
Top
2 by
Immediate Impact (updated in JAN 2008); Top
15 by Immediate Impact (updated in OCT 2007); Top
18 during 2007
Go back to my Home Page
SELECTED JOURNAL PAPERS
1.
K.B. Mustapha,
Z.W. Zhong, Spectral
element analysis of a non-classical model of a spinning micro beam embedded in an
elastic medium, Mechanism and Machine Theory 53 (2012) 66-85.
2.
K.B. Mustapha,
Z.W. Zhong, Wave propagation characteristics of a twisted micro
scale beam, International Journal of Engineering Science 53 (2012)
46–57.
3.
K.B. Mustapha,
Z.W. Zhong, Stability of single-walled carbon nanotubes
and single-walled carbon nanocones under self-weight
and an axial tip force, International
Journal of Engineering Science 50 (1) (2012) 268-278.
4.
Z.W. Zhong, Overview
of wire bonding using copper wire or insulated wire, Microelectronics Reliability 51 (1)
(2011) 4-12. The most frequently
downloaded journal article in Microelectronics Reliability during JAN -
MAR 2011: Top
1
5.
Z.W. Zhong, X C Shan, S J Wong, Roll-to-roll large-format slot die coating of
photosensitive resin for UV embossing, Microsystem
Technologies-Micro-and Nanosystems-Information
Storage and Processing Systems 17 (12) (2011) 1703-1711.
6.
Y.B. Tian, L. Zhou, Z W Zhong, H.
Sato, J. Shimizu, Finite element analysis of deflection and residual
stress on machined ultra-thin silicon wafers, Semiconductor Science and Technology, 26 (2011) 105002 doi:10.1088/0268-1242/26/10/105002.
7.
Z.W.
Zhong, B. Song, P.E. Loh, LCAs
of a polycrystalline photovoltaic module and a wind turbine, Renewable
Energy 36 (8) (2011) 2227-2237.
8.
M.C.G. Lim, Z.W. Zhong, Dynamical
behavior of copper atoms in a carbon nanotube channel,
Carbon 49 (3) (2011) 996-1005.
9.
M.C.G. Lim, Z.W. Zhong, The junction size effect on the electromigration
flow of copper atoms through carbon-nanotube
junctions, Physica
E 43 (4) (2011) 862-868.
10.
M.C.G. Lim, Z.W. Zhong, Effects of electromigration
on copper atoms in carbon nanotube channels, Physica A
390 (5) (2011) 963-971.
11.
Z.W. Zhong, M.H. Leong, X.D. Liu, The
wear rates and performance of three mold insert
materials, Materials & Design 32 (2)
(2011) 643-648.
12.
J.H Zhou, C.K.
Pang, F.L. Lewis, Z.W. Zhong, Dominant Feature Identification for Industrial Fault
Detection and Isolation Applications,
Expert Systems With Applications 38 (8) (2011) 10676-10684.
13.
J.H. Zhou, C.K.
Pang, Z.W. Zhong, F.L. Lewis, Tool
Wear Monitoring Using Acoustic Emissions by Dominant-Feature Identification, IEEE Transactions on Instrumentation
and Measurement 60 (2) (2011) 547-559.
14.
K.B. Mustapha,
Z.W. Zhong, The thermo-mechanical vibration of a
single-walled carbon nanotube studied using the Bubnov–Galerkin method, Physica E 43 (1) (2010) 375-381.
15.
K.B. Mustapha,
Z.W. Zhong, Free
transverse vibration of an axially loaded non-prismatic single-walled carbon nanotube embedded in a two-parameter elastic medium,
Computational Materials Science 50 (2) (2010) 742-751.
16.
M.C.G. Lim, Z.W. Zhong, Atomic
arrangement of copper atoms in a carbon nanotube
channel under electromigration conditions,
Chemical Physics Letters 500 (1-3) (2010) 49–53.
17.
Z.W.
Zhong, B. Song, M.B.M. Zaki, Life-cycle
assessment of flash pyrolysis of wood waste, Journal of Cleaner Production 18 (12) (2010) 1177-1183.
18.
B. Lotfi, Z.W.
Zhong, L.P. Khoo, A
novel algorithm to generate backlash-free motions, Mechanism and Machine
Theory 45 (8) (2010) 1171-1184.
19.
L.Y. Zhai, L.P.
Khoo, Z.W. Zhong, Towards
a QFD-based expert system: A novel extension to fuzzy QFD methodology using
rough set theory, Expert Systems with Applications 37 (12) (2010) 8888-8896.
20.
L P Yeo, S H Ng,
Z F Wang, H M Xia, Z P Wang, V S Thang, Z W Zhong, N
F de Rooij, Investigation
of hot roller embossing for microfluidic devices,
Journal of Micromechanics and Microengineering 20 (1) (2010) 015017 (10pp) doi:10.1088/0960-1317/20/1/015017
Online at stacks.iop.org/JMM/20/015017.
21.
Z.W. Zhong, X.C.
Shan, Y.C. Yao, Investigation
of antiadhesive coatings for nanoimprinting
lithography, Materials and Manufacturing Processes 25 (7) (2010)
658-664.
22.
M.C.G. Lim, Z.W. Zhong, Effects
of fluid flow on the oligonucleotide folding in
single-walled carbon nanotubes, Physical Review E
80 (4) (2009) 041915-1−041915-8. DOI:
10.1103/PhysRevE.80.041915.
23.
J.H Zhou, C.K.
Pang, F.L. Lewis, Z.W. Zhong, Intelligent
Diagnosis and Prognosis of Tool Wear Using Dominant Feature Identification,
IEEE Transactions on Industrial Informatics, 5 (4) (2009) 454-464.
24.
Z.W. Zhong, T.Y.
Tee, Overview
of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die
CSPs, Proceedings of the IEEE 97 (1) (2009) 175-183 INVITED PAPER. (Proceedings of the IEEE is an
SCI journal with an Impact Factor of 5.096 and
a 5-Year Impact Factor of 6.155 in
2010, an Impact Factor of 4.878 and a 5-Year
Impact Factor of 6.039 in 2009,
an Impact Factor of 4.613 and a 5-Year Impact Factor of 6.824 in 2008, Top-3 journal in 2010 out of 247, Top-2 journal in 2009
out of 245, Top-5 journal in 2008 and Top-1 in 2007 out of 229 SCI journals in subject categories of Engineering, Electrical &
Electronic).
25.
B. Lotfi, Z.W.
Zhong, L.P. Khoo, Prediction
of cutting forces along Pythagorean-hodograph curves, International Journal of Advanced Manufacturing Technology 43 (9-10)
(2009) 872-882.
26.
M.C.G. Lim, Z.W.
Zhong, Molecular
dynamics analyses of an Al(110) surface, Physica A 388 (19) (2009) 4083-4090.
27.
M. Xie, Z.W. Zhong, L. Zhang, L.B. Xian, L. Wang, H.J. Yang,
C.S. Song, J. Li, A
Deterministic Way of Planning and Controlling Biped Walking of LOCH Humanoid
Robot, Industrial
Robot 36 (4) (2009) 314-325.
28.
Z.W. Zhong, Fine
and ultra-fine pitch wire bonding: challenges and solutions,
Microelectronics International 26 (2) (2009) 10-18.
29.
N.G. Shankar, N. Ravi, Z.W. Zhong, A
Real-Time Print-Defect Detection System for Web Offset Printing, Measurement
42 (5) (2009) 645-652.
30.
L.Y.
Zhai, L.P. Khoo, Z.W. Zhong, A
rough set based QFD approach to the management of imprecise design information
in product development, Advanced Engineering
Informatics 23 (2) (2009)
222-228.
31.
Z.W.
Zhong, B. Song, C.X. Huang, Environmental
impacts of three polyhydroxyalkanoate (PHA)
manufacturing processes, Materials
and Manufacturing Processes 24 (5) (2009) 519-523.
32.
Z.W. Zhong, V.C. Venkatesh, Recent
developments in grinding of advanced materials, International Journal of Advanced Manufacturing Technology 41 (5-6)
(2009) 468-480.
33.
J.H.
Zhou, Z.W. Zhong, M. Luo, C. Shao, Wavelet-based
correlation modelling for health assessment of fluid
dynamic bearings in brushless DC
motors, International Journal of Advanced Manufacturing Technology 41 (5-6) (2009) 421-429.
34.
L.Y. Zhai, L.P.
Khoo, Z.W. Zhong, A
rough set based decision support approach to improving consumer affective satisfactions
in product design, International Journal of Industrial Ergonomics 39 (2)
(2009) 295-302.
35.
L.Y.
Zhai, L.P. Khoo, Z.W. Zhong, Design
concept evaluation in product development using rough sets and grey relation
analysis, Expert Systems with Applications 36 (3) (2009) 7072-7079.
36.
Z.W. Zhong, Wire
bonding using copper wire, Microelectronics International 26 (1) (2009)
10-16.
37.
B. Lotfi, Z.W.
Zhong, L.P. Khoo, Variable
feed rates and variable machine forces for a constant material removal rate and
constant cutting force along Pythagorean-hodograph curves, International Journal of Advanced Manufacturing Technology 40 (1-2) (2009), 171–178.
38.
L.P. Zhao, N. Bai, X. Li, Z.P. Fang, Z.W. Zhong,
A.A. Hein, Improving
the system stability of a digital Shack–Hartmann wavefront sensor with a special lenslet
array, Applied Optics 48 (1) (2009) A71-A74.
39.
L.Y.
Zhai, L.P. Khoo, Z.W. Zhong, A
dominance-based rough set approach to Kansei
Engineering in product development, Expert
Systems with Applications 36 (1) (2009) 393-402.
40.
Z.W. Zhong, Recent
advances in polishing of advanced
materials, Materials and Manufacturing Processes 23 (5) (2008)
449-456.
41.
Z.W. Zhong, Wire bonding of low-k devices,
Microelectronics International 25 (3) (2008) 19-25.
42.
Z.W. Zhong, Wire
bonding using insulated wire and new challenges in wire bonding, Microelectronics International 25 (2) (2008)
9-14.
43.
M.C.G. Lim, Q.X.
Pei, Z.W. Zhong, Translocation
of DNA oligonucleotide through carbon nanotube channels under induced pressure difference, Physica A 387 (13) (2008) 3111-3120.
44.
L.Y.
Zhai, L.P. Khoo, Z.W. Zhong, A
rough set enhanced fuzzy approach to quality function deployment, International
Journal of Advanced Manufacturing Technology 37 (5-6) (2008) 613-624.
45.
Z.W. Zhong, P. Arulvanan, C.K. Goh, Effects
of four key process variables on size shrinkages of low temperature co-fired
ceramic substrates, Materials and Manufacturing Processes 23 (1) (2008)
21-28.
46.
M.K. Sakharkar, P. Li, Z. Zhong, K.R. Sakharkar,
Quantitative analysis on the
characteristics of targets with FDA approved drugs, International Journal
of Biological Sciences 4 (1) (2008) 15-22. http://www.biolsci.org/v04p0015.htm.
47.
Zhong Z.W., Z.F. Peng, N. Liu, Surface Roughness
Characterization of Thermally Sprayed and Precision
Machined WC-Co and Alloy-625 Coatings, Materials Characterization 58 (10) (2007) 997-1005.
48.
Z.W. Zhong, Z.F.
Wang, B.M.P. Zirajutheen, Y.S. Tan, Y.H. Tan, Polishing of poly(methyl
methacrylate), polycarbonate, and SU-8 polymers, Materials Science-Poland, 25 (1) (2007) 103-112.
49.
Z.W. Zhong, P. Arulvanan, H.P. Maw, C.W.A. Lu, Characterization
of SnAgCu and SnPb solder
joints on low temperature co-fired ceramic substrate, Soldering &
Surface Mount Technology 19 (4) (2007) 18-24.
50.
Z.W. Zhong, T.Y.
Tee, J.-E. Luan, Recent
advances in wire bonding, flip chip
and lead-free solder for advanced microelectronics packaging,
Microelectronics International, 24 (3)
(2007) 18-26.
51.
Z.W. Zhong, S.Y. Chan, Investigation
of a Gripping Device Actuated by SMA Wire, Sensors
and Actuators A: Physical 136 (1) (2007) 335-340.
52.
J.E. Luan, T.Y.
Tee, E. Pek, C.T. Lim, Z. Zhong, Dynamic
responses and solder joint reliability under board level drop test, Microelectronics
Reliability 47 (2-3) (2007) 450-460.
53.
K.S. Goh, Z.W. Zhong, Two
capillary solutions for ultra-fine-pitch wire bonding and insulated wire
bonding, Microelectronic Engineering 84 (2) (2007) 362-367.
54.
Z.W. Zhong, H.M. Ho, Y.C. Tan, W.C. Tan, H.M. Goh, B.H.
Toh, J. Tan, Study
of factors affecting the hardness of ball bonds in copper wire bonding, Microelectronic
Engineering 84 (2) (2007) 368-374.
55.
S.K. Nah, Z.W.
Zhong, A
microgripper using piezoelectric actuation for
micro-object manipulation, Sensors and Actuators A: Physical 133
(1) (2007) 218–224.
56.
K.S. Goh, Z.W. Zhong, A
new bonding-tool solution to improve stitch bondability, Microelectronic
Engineering 84 (1) (2007) 173-179.
57.
Z.W. Zhong, Z.F. Peng, Fractal roughness structures of
precision-machined
WC-Co- and Inconel 625-coated steel rods, The
International Journal of Advanced Manufacturing Technology 33 (9-10) (2007) 885-890.
58.
P. Arulvanan, Z.W. Zhong, Assembly and reliability of
PBGA packages on FR-4 PCBs with SnAgCu solder, Microelectronic
Engineering 83 (11-12) (2006) 2462-2468.
59.
N.G. Shankar and Zhong, Z.W., Improved Segmentation of Semiconductor Defects using
Area Sieves, Machine Vision and Applications, Vol. 17, No. 1, 2006, pp. 1-7.
60.
Zhong Z.W. and G. Lin, Ultrasonic
Assisted Turning of an Aluminium-Based Metal Matrix
Composite Reinforced with SiC Particles, The International Journal of Advanced
Manufacturing Technology, Vol. 27,
Nos. 11-12, 2006, pp. 1077-1081.
61.
J.E. Luan, T.Y.
Tee, E. Pek, C.T. Lim, Z. Zhong, J. Zhou, Advanced
Numerical and Experimental Techniques for Analysis of Dynamic Responses and
Solder Joint Reliability during Drop Impact, IEEE Transactions on Components
and Packaging Technologies 29 (3) (2006) 449-456.
62.
T. Y. Tee, H.S. Ng and Zhong Z., "Board
Level Solder Joint Reliability Analysis of Stacked Die Mixed Flip-Chip and Wirebond BGA," Microelectronics
Reliability 46 (12) (2006) 2131-2138.
63.
K.S. Goh, and Zhong Z.W., “Development
of capillaries for wire bonding of low-k
ultra-fine-pitch devices,”
Microelectronic
Engineering, Vol. 83, No. 10, 2006, pp. 2009-2014.
64.
T.Y. Tee, H.S.
Ng, Zhong Z. and J. Zhou, "Board-Level
Solder Joint Reliability Analysis of Thermally Enhanced BGAs and LGAs,"
IEEE Transactions on Advanced Packaging, Vol. 29, No. 2, May 2006, pp. 284-290.
65.
Zhong Z.W. L.P. Khoo and S.T. Han, “Prediction of surface roughness
of turned surfaces using neural networks,” The International Journal of
Advanced Manufacturing Technology, Vol. 28,
Nos. 7-8, 2006, pp. 688-693.
66.
Zhong Z.W., L.P. Zhao, H.H. Lin, “Development and investigation of an optical tilt sensor,” Optics
Communications, 261/1 2006, pp. 23-28.
67.
N.G. Shankar and Zhong, Z.W., “A
Rule-Based Computing Approach for the Segmentation of Semiconductor Defects,”
Microelectronics
Journal, Vol. 37, No. 6, 2006, 500-509.
68.
Zhong,
Z.W., C.K. Yeong, “Development
of a Gripper Using SMA Wire,” Sensors
and Actuators A: Physical, Vol. 126, No. 2, 2006, pp. 375-381.
69.
Zhong Z.W., and K.S. Goh, “Investigation
of ultrasonic vibrations of wire-bonding capillaries,” Microelectronics
Journal, Vol. 37, No. 2, 2006, pp. 107-113.
70.
Arulvanan P., Zhong Z. and X. Q. Shi, “Effects
of process conditions on reliability, microstructure evolution and failure
modes of SnAgCu solder joints,” Microelectronics
Reliability, Vol.
46, Nos. 2-4, 2006, pp. 432-439.
71.
Zhong, Z.W.; Wang, Z.F.; Tan, Y.H., Chemical
Mechanical Polishing of Polymeric Materials for MEMS Applications,” Microelectronics
Journal, Vol. 37, No. 4, 2006, pp. 295-301.
72.
Zhong Z.W., Arulvanan P., X.Q. Shi, Lead-free
PCB Assembly and Effects of Process Conditions on the Profile and Reliability
of Solder Joints, Soldering & Surface Mount Technology, Vol. 17, No. 4, 2005, pp. 33-37.
73.
N.G. Shankar, and Zhong, Z.W., “A
New Rule-Based Clustering Technique for Defect Analysis,” Microelectronics
Journal, Vol. 36, No. 8, 2005, pp. 718-724.
74.
Zhong Z.W. and Z.Y. Rui, “Grinding of Single-Crystal Silicon Using a
Micro-Vibration Device,” Materials and Manufacturing Processes, Vol. 20,
No. 4, 2005, pp. 687-696.
75.
Zhong Z.W. and G. Lin,
“Diamond Turning of a Metal Matrix Composite with Ultrasonic
Vibrations,” Materials and Manufacturing Processes, Vol. 20, No. 4, 2005,
pp. 727-735.
76.
J. Tan, Z.W.
Zhong, and H. M. Ho, “Wire
Bonding Process Development for Low-k
Materials,” Microelectronic
Engineering, Vol. 81, No. 1, 2005, pp. 75-82.
77.
N.G. Shankar and Zhong, Z.W., “Defect
Detection on Semiconductor Wafer Surfaces,” Microelectronic
Engineering, 77/3-4, 2005, pp. 337-346.
78.
Zhong Z.W.,
“Various adhesives for flip chips,” ASME Journal of Electronic Packaging, Vol. 127, Issue 1, Mar.
2005, pp. 29-32.
79.
Zhong Z.W., S. C.
Lim, and A. Asundi, “Optical fiber shifts and shear strains in V-groove
arrays for optical MEMS packaging,” ASME Journal of Electronic Packaging, Vol. 127, Issue 1,
Mar. 2005, pp. 25-28.
80.
Zhong Z.W., Z.F. Wang, and Zirajutheen B.M.P.,
“Chemical
mechanical polishing of polycarbonate and poly methyl methacryate
substrates,” Microelectronic
Engineering, Vol. 81, No. 1, 2005, pp. 117-124.
81.
Zhong Z.W., S. C. Lim, and A.
Asundi, “Effects
of thermally induced optical fiber shifts in V-groove arrays for optical MEMS,”
Microelectronics
Journal, Volume 36, Issue 2, 2005, pp. 109-113.
82.
Zhong, Z.W., and Lu Y.G., An AFM Scanning Moire
Technique for the Inspection of Surface Deformations, The International Journal of Advanced Manufacturing Technology, Vol. 23, Nos. 5-6, March 2004, pp. 462-466.
83.
Zhong, Z.W. and
H. B. Yang, “Development of a vibration device for grinding with microvibration”, Materials and Manufacturing
Processes, Vol. 19, No. 6, 2004, pp. 1121-1132.
84.
Zhong Z.W. and T. M. Lye, “Effects
of Profiles and Conditioning Methods of Heater Surfaces on Deposited TiN Film Thickness and Uniformity,” Microelectronic
Engineering, Vol. 75, No. 4, 2004, pp. 405-412.
85.
Tee T.Y. and Zhong Z., “Board
Level Solder Joint Reliability Analysis and Optimization of Pyramidal Stacked
Die BGA Packages”,
Microelectronics
Reliability, Vol. 44, No. 12, 2004, pp. 1957-1965.
86.
Zhong,
Z.W., K.W. Wong and X.Q. Shi,
“Interfacial behaviour of a flip chip structure
under thermal testing,” IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 27, No. 1, 2004,
pp. 43-48.
87.
Zhong Z.W. and S. H. Gee,
“Failure Analysis of Ultrasonic Pitting and Carbon Voids on Magnetic
Recording Disks”, Ceramics International, 30/7, 2004, pp. 1619-1622.
88.
Zhong Z.W., “Thermal
Strain Analysis of IC Packages Using Various Moiré Methods,” Microelectronics International, Vol. 21, No. 3,
2004, pp. 25–28.
89.
T. Y. Tee, H.S. Ng, C.T. Lim, E. Pek, and Zhong, Z., “Impact
Life Prediction Modeling of TFBGA Packages under Board Level Drop Test”,
Microelectronics
Reliability, Vol. 44, No. 7, 2004, pp. 1131-1142.
90.
Zhong, Z.W. and
Y. Jiang, “LED lighting configurations for visual inspection of IC
packages”, Materials and Manufacturing Processes, Vol. 19, No. 3, 1 July
2004, pp. 439-449.
91.
Tee, T. Y. and Zhong, Z., “Integrated
Vapor Pressure, Hygroswelling,
and Thermo-mechanical Stress Modeling of QFN Package during Reflow with Interfacial Fracture Mechanics Analysis”, Microelectronics
Reliability, Vol. 44, No. 1, 2004, pp. 105-114.
92.
Gan, J., Wang, X., Zhou, M., Ngoi B.,
and Zhong, Z., Ultraprecision Diamond Turning of
Glass with Ultrasonic Vibration, The International Journal of Advanced Manufacturing
Technology, Vol. 21, Vol. 12, 2003, pp. 952-955.
93.
Zhong, Z.W., and
Zheng, Z., “Head-Disk Interfacial Behavior in Glide Tests for
Manufacturing Hard Disks,” Materials and Manufacturing Processes, Vol.
18, No. 1, 2003, pp. 123-134.
94.
Zhong, Z.W., “Grinding of Aluminum-Based Metal
Matrix Composites Reinforced with Al2O3 or SiC Particles,” The
International Journal of Advanced Manufacturing Technology, 21 (2003) 2, pp.
79-83.
95.
Zhong Z.W. and T.
M. Lye, “Effects of heater surface pre-coating and plasma treatment on
deposited TiN film thickness,” Surface
Engineering, 2003, vol. 19, no. 4, pp. 274-278.
96.
Zhong, Z.W., and
W.H. Tok, "Grinding of Single-Crystal Silicon
Along Crystallographic Directions", Materials
and Manufacturing Processes, Vol. 18, No. 5, 2003, pp. 811-824.
97.
Zhong Z.W. and S.
K. Nah, “Thermal
strain analysis of an electronics package using the SEM moiré technique,”
Soldering & Surface Mount Technology,
Vol. 15, No. 3, 2003, pp. 33-35.
98.
K.C. Chan, Teo M.
and Zhong, Z.W., “Characterization
of Low-k Benzocyclobutene Dielectric Thin Film,”
Microelectronics International, Vol. 20,
No. 3, 2003, pp. 11-22.
99.
Tee, T. Y., H. S. Ng, D. Yap, Zhong, Z., “Comprehensive
Board Level Solder Joint Reliability Modeling and
Testing of QFN and PowerQFN Packages”, Microelectronics
Reliability, 43(8), pp. 1329-1338.
100.
Zhong, Z.W., “Ductile or Partial Ductile Mode
Machining of Brittle Materials,” The
International Journal of Advanced Manufacturing Technology, Vol. 21, No. 8, 2003, pp. 579-585.
101. Tee, T. Y., H. S. Ng, D. Yap, X. Baraton, Zhong, Z., “Board
Level Solder Joint Reliability Modeling and Testing of TFBGA Packages for
Telecommunication Applications”,
Microelectronics
Reliability, Vol. 43(7), pp. 1117-1123.
102.
Zhong, Z.W., and
Zheng Z., “Flying
Height Deviations in Glide Height Tests,” Sensors
and Actuators A: Physical, Vol. 105, No. 3,
2003, pp. 255-260.
103.
Zhong, Z., Yip,
P.K., Finite
element analysis of a three dimensional package, Soldering & Surface
Mount Technology, Vol. 15, No. 1, 2003, pp.
21-25.
104. Chan K.C., Zhong Z.W., and Ong K.W., “Study
of under bump metallization barrier layer for lead-free solder,” Soldering & Surface Mount Technology, Vol. 15, No. 2, 2003, pp. 46-52.
105. Ramesh K., Yeo S.H., Zhong, Z.W., and Huang H., “Ecological grinding with chilled air as
coolant”, Proceedings
of the Institution of Mechanical Engineers. Part B, Journal of Engineering
Manufacture, Vol. 217 (3),
2003, pp. 409-419.
106. Zhong Z.W., and Lu Y.G.,
"Fractal roughness structure of diamond-turned copper mirrors",
Materials and Manufacturing Processes, Vol. 18, No. 2, 2003, pp. 219-227.
107. Tee, T. Y., C. L. Kho, D. Yap, C. Toh, X. Baraton, Zhong,
Z., “Reliability
Assessment and Hygroswelling Modeling of FCBGA with
No-flow Underfill”,
Microelectronics
Reliability, Vol 43(5), pp. 741-749.
108.
Ramesh K., Yeo S.H., Zhong, Z.W., and Yui
A. “Ultra-High-Speed Behavior of a Rolling Element upon using Oil-Air
Mist Lubrication,” Journal of Materials Processing Technology, Vol. 127,
2002, pp. 191-198.
109.
Xie, H.M.,
Asundi, A., Chai, G.B., Lu, Y.G., Yu J.,. Zhong, Z.,
“High
resolution AFM scanning Moiré method and its application to the
micro-deformation in the BGA electronic package,” Microelectronics
Reliability, 42 (8), 2002, pp. 1219 –1227.
110.
Zhong, Z.W., and
Han, Z.Z., “Turning of Glass with Abrasive Waterjet,”
Materials and Manufacturing Processes, Vol. 17, No.3, 17 June 2002, pp.
339-349.
111.
Yeo S.H., Ramesh K., and Zhong, Z.W., “Ultra-high-speed
grinding spindle characteristics upon using oil/air mist lubrication”, International Journal of Machine Tools
and Manufacture 42 (7) (2002) pp. 815-823.
112.
Zhong, Z.W., and
Lu Y.G., “3D Characterization of Super-Smooth Surfaces of Diamond Turned
OFHC Copper Mirrors,” Materials and Manufacturing Processes, Vol. 17, No.
2, 1 May 2002, pp. 269-280.
113.
Zhong, Z., and
Hung, N.P., “Grinding of Alumina/Aluminum
Composites,” Journal of Materials Processing Technology, Vol. 123, No. 1,
2002, pp. 13-17.
114.
Zhong, Z.,
“Surface Finish of Precision Machined
Advanced Materials,” Journal of Materials Processing Technology,
Vol. 122, No. 2-3, 2002, pp. 173-178.
115.
Zhou, M., Ngoi B.K.A., and Zhong, Z.W., Wang
X.J., The Effect of Material Microstructure on Microcutting
Processes, Materials and Manufacturing Processes, Vol. 16, No. 6, Nov. 2001,
pp. 815-828.
116.
Zhou, M., Ngoi B.K.A., Zhong, Z.W., and Chin,
C.S. Brittle-Ductile Transition in Diamond Cutting of Silicon Single Crystals,
Materials and Manufacturing Processes, Vol. 16, No. 4, 2001, pp. 447-460.
117. Zhong Z.W., and Lee W. Y.
“Grinding of Silicon and Glass Using a New Dressing Device and an
Improved Coolant System,” Materials and Manufacturing Processes, Vol. 16,
No. 4, 2001, pp. 471-482.
118.
Zhong, Z.,
“Stud
bump bond packaging with reduced process steps,” Soldering &
Surface Mount Technology, Vol. 13, No. 2,
2001, pp. 35-38.
119.
Zhong, Z.,
“Reliability
of FCOB with and without encapsulation,” Soldering & Surface
Mount Technology, Vol. 13, No. 2, 2001, pp.
21-25.
120.
Ramesh K., Yeo S.H., Zhong, Z.W., and Sim, K.C.,
“Coolant shoe development for high efficiency grinding,” Journal of
Materials Processing Technology, Vol. 114, 2001, pp. 240-245.
121.
Zhong, Z., Ramesh K., and Yeo S.H. “Grinding of Nickel-Based
Super-Alloys and Advanced Ceramics,” Materials and Manufacturing
Processes, Vol. 16, No. 2, March 2001, pp. 195-207.
122.
Zhong, Z.,
“Flip
chip assemblies using gold bumps and adhesive,” Microelectronics International, Vol. 18, No. 3,
Sep. 2001, pp. 15-19.
123.
Lu, Y.G., Zhong,
Z.W., Yu J., Xie, H.M., Chai, J.B., and Asundi, A., “Thermal Deformation Measurement of Electronic
Packages Using Atomic Force Microscope Scanning Moiré Technique,” Review
of Scientific Instruments, Vol. 72, No. 4, American Institute of Physics, April
2001, pp. 2180-2185.
124.
Zhong, Z.,
“Machining of Thermally Sprayed WC-Co Coatings,” Materials and
Manufacturing Processes, Vol. 16, No. 1, Jan. 2001, pp. 103-112.
125.
Zhong, Z., and K.
S. Goh, “Analysis and Experiments of Ball Deformation for
Ultra-Fine-Pitch Wire Bonding,” Journal of Electronics Manufacturing,
Vol. 10, No. 4, Dec. 2000, pp. 211-217.
126.
Zhong, Z., and K.
S. Goh, “Flip Chip on FR-4, Ceramics and Flex,” Journal of
Electronics Manufacturing, Vol. 10, No. 2, June 2000, pp. 89-96.
127.
Zhong, Z., and
Hung, N.P., “Diamond Turning and Grinding of Aluminum-Based Metal Matrix Composites,” Materials and
Manufacturing Processes, Vol. 15, No. 6, Nov. 2000, pp. 853-865.
128.
Hung,
N.P., T. C. Tan, Zhong, Z.W., and G. W. Yeow, “Ductile-regime machining
of particle-reinforced
metal matrix
composites,” Machining Science and
Technology, Vol. 3, Issue 2, Dec. 1999, pp. 255-271.
129.
Hung
NP, Zhong, Z.W., Lee K.K. and Chai C.F. “Precision Grinding and Facing of
Copper-Beryllium Alloys,” Precision Engineering - Journal of ASPE, Vol.
23, No.4, Oct. 1999, pp.293-304.
130.
Zhong,
Z., “Assembly
and Reliability of Flip Chip on Boards Using ACAs or Eutectic Solder with Underfill,” Microelectronics
International, Vol. 16, No. 3, Sep. 1999, pp. 6-14.
131.
Zhong,
Z., “Grinding of Toroidal and Cylindrical
Surfaces on SiC Using Diamond Grinding Wheels,”
Materials and Manufacturing Processes, Vol. 12, No. 6, 1997, pp. 1049-1062.
132.
Hung
NP, Zhong, Z.W., Zhong CH, “Grinding of Metal Matrix Composites Reinforced
with Silicon-Carbide Particles,” Materials and Manufacturing Processes,
Vol. 12, No. 6, 1997, pp. 1075-1091.
133.
Venkatesh,
V.C., Zhong, Z., and Wihardjo, E., "Studies on
Polishing of Glass Moulds after Lapping with Hard and Soft Pellets,"
Journal of Materials Processing Technology, Vol. 62, No. 4, Dec. 1996, pp.
415-420.
134.
Zhong,
Z., and Nakagawa, T., "Grinding of Aspherical SiC Mirrors," Journal of Materials Processing
Technology, Vol.56, Nos.1-4, Jan. 1996, pp. 37-44.
135.
Zhong,
Z., and Venkatesh, V.C., "Semi-Ductile Grinding
and Polishing of Ophthalmic Aspherics and Spherics," Annals of CIRP, VOL.44/1, 1995, pp.339-342.
136.
Zhong,
Z., and Venkatesh, V.C., "Generation of
parabolic and toroidal surfaces on silicon and
silicon based compounds using diamond cup grinding wheels," Annals of
CIRP, VOL.43/1, 1994, pp.323-326.
137.
Zhong,
Z., and Venkatesh, V.C., "Surface Integrity
Studies on the Grinding, Lapping and Polishing Processes for Optical
Products," Journal of Materials Processing Technology, Vol.44, Nos.3-4, Aug.
1994, pp.179-186.
138.
Zhong,
Z., "New Grinding Methods for Aspheric Mirrors with Large Curvature
Radii," Annals of CIRP, VOL. 41/1, 1992, pp. 335-338.
139. Zhong, Z.W., and Nakagawa, T., Development of a Micro-Displacement Table for
Ultra-Precision Machining and Grinding for Curved Surfaces by the Use of It, International Journal of the Japan Society for Precision
Engineering, Vol.26, No.2, June 1992, pp. 102-107.
SELECTED BOOK CHAPTERS
1.
L.
P. Khoo, Zhong, Z.W., and H. Y. Lim, Maintenance Planning Using Enterprise
Data Mining, Recent Advances in Data Mining of Enterprise Data, Edited by T.W. Liao and E. Triantaphyllou,
World Scientific, Singapore,
2008, pp. 505-544.
2. L.P. Khoo, Zhong, Z., and H.Y. Lim, “A Rough Set Based Tabu-Enhanced Genetic Algorithm Approach to Rule Induction,” Evolutionary Algorithms and Intelligent Tools in Engineering Optimization, Edited by W. Annicchiarico, J. Périaux, M. Cerrolaza and G. Winter, jointly published by CIMNE, Barcelona, Spain and WIT Press, Billerica, MA, 2005, pp. 141-166.
3. Zhong, Z., "Image Scanners," Wiley Encyclopedia of Electrical and
Electronics Engineering, Edited by J.G. Webster, John Wiley & Sons,
USA, Vol. 9, 1999, pp. 634-642.
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SELECTED INTERNATIONAL
CONFERENCE PAPERS
1. C.K. Pang, J.-H. Zhou, Z.-W. Zhong, F.L. Lewis, (Invited Paper) "Industrial Fault
Detection and Isolation Using Dominant Feature Identification," The 8th
Asian Control Conference (ASCC 2011), Kaohsiung, Taiwan, May 15-18, 2011, pp.
1018-1023. Won The Best Application
Paper Award.
2.
J.-H Zhou, D.H. Zhang, S.A. Arogeti, M. Luo, D.W. Wang, Z.-W. Zhong, “iDiagnosis
& Prognosis - An Intelligent Platform for Complex Manufacturing,”
in Proceedings of the 2009 IEEE/ASME International Conference on Advanced
Intelligent Mechatronics (AIM), WB5.3, pp.
405-410, Singapore, July 14-17, 2009.
3.
C.K. Pang, J.-H
Zhou, F.L. Lewis, Z.-W. Zhong, “Tool Wear Forecast Using Singular Value
Decomposition for Dominant Feature Identification," in Proceedings of the
2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), WB5.6, pp. 421-426, Singapore, July
14-17, 2009.
4.
Z.W. Zhong, W.
Fan,C.W. Low, Investigation
of the performance of micro-thermoelectric coolers, Proceedings of SPIE
Vol. 7269, art. no. 72690V, Micro- and
Nanotechnology: Materials, Processes, Packaging, and Systems IV, SPIE
Smart Materials, Nano- and Micro-Smart Systems
Symposium, Melbourne, Australia, 2008.
5.
Xie, Z.W. Zhong, L. Zhang, H. J. Yang, C. S. Song, J. Li,
L. B. Xian and L. Wang, “Self Learning of Gravity Compensation by
Humanoid Robot,” 2008 8th IEEE-RAS
International Conference on Humanoid Robots (Humanoids 2008), Daejeon, Korea, 2008.
6.
L. Wang,
M. Xie, Z.W. Zhong, H.J. Yang and J. Li, 2008, Design of Dexterous Arm-Hand for
Human-Assisted Manipulation, 2008
International Conference on Intelligent Robotics and Applications,
Wuhan, China, 2008.
7.
L. Wang, M. Xie, Z.W. Zhong, C. Wang and L. Zhang, “Power
Analysis and Structure Optimization in the Design of a Humanoid Robot,”
Proceedings of 11th International Conference on Climbing and Walking Robots and the
Support Technologies for Mobile Machines (CLAWAR2008), Portugal, 2008, pp.
55-62.
8.
M. Xie, Z.W. Zhong, L. Zhang, L. B. Xian, L. Wang, H. J.
Yang, C. S. Song and J. Li, “A Deterministic Way of Planning and
Controlling Biped Walking of LOCH Humanoid Robot,” Proceedings of 11th International
Conference on Climbing and Walking Robots and the Support Technologies for
Mobile Machines (CLAWAR2008), Portugal, 2008, pp. 1181-1190. Won The Best Paper Award: Industrial Robot
Innovation Award 2008, awarded by Industrial Robot: An International
Journal, Emerald.
9.
B. Song, C.X.
Huang, Z.W. Zhong, “LCA Modelling and Analysis of PHA Manufacturing by Alternative
Processes,” Proceedings of 15th
CIRP International Conference on Life Cycle Engineering, Sydney, Australia,
17-19 March 2008, pp. 303-308.
10. Z.W. Zhong, S.K. Nah and S.H. Tan, “Design and development of micro-gripping
devices for manipulation of micro-parts,” Proceedings of 10th International
Conference on Climbing and Walking Robots and the Support Technologies for
Mobile Machines (CLAWAR2007), Singapore, 16–18 July, 2007, pp. 599-606.
11. X. Li, M. Luo, X.W. Yang, Z.W.
Zhong, “Application of neural network for prediction of slip free
temperature offsets in semiconductor epitaxial process,” Proceedings of
The 2nd World Congress on Engineering Asset Management and
the 4th International Conference on Condition Monitoring (WCEAM-CM2007), Harrogate, United Kingdom, 11-14 June 2007, pp.
1251-1258.
12. J.H. Zhou, M. Luo, C. Shao, Z.W. Zhong, “Fluid dynamic bearing wear
detection in brushless DC motor using wavelet-based correlation modelling,” Proceedings
of The 2nd World Congress on Engineering Asset Management and
the 4th International Conference on Condition Monitoring (WCEAM-CM2007), Harrogate, United Kingdom, 11-14 June 2007, pp.
2249-2258.
13. T. Y. Tee, J.E. Luan, E. Pek, C.T. Lim, and Zhong Z., "Advanced
Experimental and Simulation Techniques for Analysis of Dynamic Responses during
Drop Impact", 54th ECTC (Electronic Components and Technology)
Conference, USA, June 2004, 1088-1094.
14.
Zhong Z.W., T. Y. Tee and K. O. Liew, “Finite
Element Analysis of Sequential Processes for Ball Grid Array Packages”,
Proceedings of
5th Electronics Packaging Technology Conference (EPTC 2003), Singapore, Dec.
2003, pp. 809-814.
15.
T. Y.
Tee, H.S. Ng, and Zhong Z.W.,
"Design
for Enhanced Solder Joint Reliability of Integrated Passives Device under Board
Level Drop Test and Thermal Cycling Test", Proceedings of 5th
Electronics Packaging Technology Conference (EPTC 2003), Singapore, Dec. 2003,
pp. 210-216.
16.
J.E.
Luan, T. Y. Tee, E. Pek, C.T. Lim, and Zhong Z.W., "Modal
Analysis and Dynamic Responses of Board Level Drop Test", Proceedings of 5th
Electronics Packaging Technology Conference (EPTC 2003), Singapore, Dec. 2003,
pp. 233-243.
17. Tee T.Y., Ng H.S., Lim C.T., Pek E. and Zhong Z., “Board
Level Drop Test and Simulation of TFBGA Packages for Telecommunication
Applications”, 53rd ECTC Conference, USA, May 2003, 121-129.
18.
Tee T.Y., Lim M., Ng H.S., Baraton
X., and Zhong
Z.W., “Design Analysis and
Optimization of Wirebond Stacked Die BGA Packages for
Improved Board Level Solder Joint Reliability”, Keynote Paper, Proceedings of the 4th
International Conference on Thermal & Mechanical Simulation and Experiments
in Micro-Electronics and Micro-Systems, EuroSIME2003 IEEE, France, 2003, pp.
207-213.
19.
K.C. Chan and Zhong Z.W., “Investigation of CrCu/Cu/Ni
Underbump Metallization for Lead-free
Applications”, Proceedings of 4th Electronics Packaging Technology
Conference (EPTC 2002), Singapore, Dec. 2002, pp. 270-275.
20. Zhong Z.W., Han CP, and Asundi A.
“A
Study of Parameters Affecting the Sensitivity of a 3-D Measurement System Using
the Phase Shifting Technique,” Proceedings
of SPIE Vol. 4398, 2001, 182-188.
21.
Asundi, Anand K.; Xie, Huimin; Yu, Jin; Zhong
Z.W., “Phase-shifting AFM moire method”,
Proceedings of SPIE Volume: 4448, 2001, pp.
102-110.
22.
Zhong Z.W., and Tham, W.W., “A study of
surface profile measurement using a CD optical pickup head,” Proceedings
of SPIE 2001, Volume 4596, pp. 48-53.
23. Zhong Z.W., and K. S. Goh,
“Finite Element Analysis and
Experiments of Ultra-Fine-Pitch Wire Bonding,” Proceedings of SPIE 2000, Volume 4229, pp. 28-35.
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