Z.W. Zhong, Doctor of Engineering

Associate Professor

Nanyang Technological University

School of Mechanical & Aerospace Engineering

50 Nanyang Avenue, Singapore 639798

Room : N3-02C-98     Phone : (65) 6790 5588

E-mail : mzwzhong@ntu.edu.sg

Web page: http://www.ntu.edu.sg/home/mzwzhong/

 

 

A PhD Scholarship to Offer

 

I have a PhD Scholarship for the Aug 12 intake. This scholarship must be used for a PhD research scholar (Singapore citizen or SPR) to get a PhD in the research area of optical and laser engineering (for example: machining, or fabrication or measurement or application of optical materials/components/systems, etc, which can be discussed and determined by you and me together). The PhD student can be attached to Singapore Institute of Manufacturing Technology (SIMTech). If you are or your friend is interested in taking this PhD Research Scholarship in order to obtain a PhD degree, please let me know (E-mail : mzwzhong@ntu.edu.sg).

 

Who is eligible?

You are eligible for this scholarship if you are a local (Singapore citizen or SPR) student seeking admission as a full-time candidate pursuing a Doctor of Philosophy (Ph.D) programme by research at NTU.

 

Eligibility criteria

  • You must have a First Class Honours or Second Class (Upper Division) Honours or its equivalent
  • You should not be on paid employment or accept paid employment or concurrently hold any other scholarship, fellowship, bursary or top-up allowance during the prescribed period of the award

 

Coverage

  • The award is renewable for 4 years.
  • In the first year, the monthly stipend will be S$2,500 for Singapore Citizens, and S$2,200 for Singapore Permanent Residents.
  • After the first year, for students who pass the Year-1 Confirmation, the stipend may be increased to S$3,000 for Singapore Citizens, and S$2,700 for Singapore Permanent Residents.
  • In addition to the monthly stipend, the award also covers the annual tuition fee and the annual computer fee.
  • The maximum period of the award is up to four years for Ph.D. candidates.

 

Bond

There is no bond attached to the scholarship.

 

Teaching opportunities

Upon year-1 confirmation of Ph.D. candidature, students on scholarships will be given the opportunity to teach. It will add value to their Curriculum Vitae, and provide valuable exposure and experience for those who wish to pursue an academic career subsequently.

 

Conference support

One overseas conference support (up to $3K) and one local conference support (up to $600) for this research area on optical and laser engineering.

 

 

 

 

 

My TEACHING (currently)

·         M6304, Ultraprecision & Micromachining Processes, Post-graduate (Masters and PhD) course, Lecture

·         M6301, Advanced Metrology and Sensing Systems, Post-graduate (Masters and PhD) course, Lecture

·         MP4G06, Artificial Intelligence & Machines, Under-graduate final year course, Lecture

·         MP3011, Engineering Design, Tutorial and design project

·         FE1012, Physics A, Tutorial

·         P3.7, Control of Vibration, Lab project

 

TEACHING (previously)

·         M6328, Optical Engineering, Post-graduate (Masters and PhD) course, Lecture

·         MP4H02 (M458), Electronics Packaging, Under-graduate final year course, Lecture

·         MP4H03 (M480), Surface Mount Technology, Under-graduate final year course, Lecture

 

MAIN RESEARCH INTERESTS

Manufacturing and Production (precision and ultra-precision engineering, microelectronics packaging); Mechatronics and Design; Modelling and Analyses

 

Our joint paper won The Best Application Paper Award at The 8th Asian Control Conference (ASCC 2011), 2011.

C.K. Pang, J.-H. Zhou, Z.-W. Zhong, F.L. Lewis, (Invited Paper) "Industrial Fault Detection and Isolation Using Dominant Feature Identification," The 8th Asian Control Conference (ASCC 2011), Kaohsiung, Taiwan, May 15-18, 2011, pp. 1018-1023.

 

My paper was the most frequently downloaded journal article in Microelectronics Reliability during JAN - MAR 2011: Top 1

Z.W. Zhong, Overview of wire bonding using copper wire or insulated wire, Microelectronics Reliability 51 (1) (2011) 4-12.

 

Our papers have been ScienceDirect TOP Hottest Articles (most frequently downloaded journal articles) (NTU library members/users may want to view the papers in the list by clicking here)

·         In Microelectronics Reliability:

OCT - DEC 2011: Top 6

JUL - SEP 2011: Top 3

APR - JUN 2011: Top 5

JAN - MAR 2011: Top 1

APR - JUN 2008: Top 17

OCT - DEC 2007: Top 4

JUL - SEP 2007: Top 9

APR - JUN 2007: Top 2

JAN - MAR 2007: Top 3

OCT - DEC 2007: Top 15

JUL - SEP 2007: Top 22

APR - JUN 2007: Top 16

JAN - MAR 2007: Top 7

OCT - DEC 2006: Top 2

JUL - SEP 2006: Top 24

APR - JUN 2006: Top 21

JAN - MAR 2007: Top 9

OCT - DEC 2006: Top 8

JUL - SEP 2006: Top 3

APR - JUN 2006: Top 6

JAN - MAR 2006: Top 1

JUL - SEP 2005: Top 6

APR - JUN 2005: Top 16

OCT - DEC 2004: Top 19

·         In International Journal of Engineering Science:

OCT - DEC 2011: Top 10

·         In Measurement:

OCT - DEC 2011: Top 25

JUL - SEP 2011: Top 7

APR - JUN 2011: Top 16

JAN - MAR 2011: Top 12

OCT 2009 – SEP 2010 Academic Year: Top 7

OCT - DEC 2010: Top 12

JUL - SEP 2010: Top 11

APR - JUN 2010: Top 7

JAN - MAR 2010: Top 12

OCT - DEC 2009: Top 11

JUL - SEP 2009: Top 8

APR - JUN 2009: Top 13

OCT - DEC 2005: Top 13

JUL - SEP 2005: Top 11

APR - JUN 2005: Top 3

·         In Physica A:

JAN - MAR 2011: Top 13

APR - JUN 2008: Top 9

·         In Mechanism and Machine Theory

JUL - SEP 2010: Top 14

·         In Advanced Engineering Informatics:

OCT - DEC 2009: Top 25

JUL - SEP 2009: Top 23

APR - JUN 2009: Top 4

·         In International Journal of Industrial Ergonomics:

JUL - SEP 2009: Top 10

APR - JUN 2009: Top 6

JAN - MAR 2009: Top 9

·         In Materials Characterization:

JAN - MAR 2008: Top 15

OCT - DEC 2007: Top 23

JUL - SEP 2007: Top 25

·         In Sensors and Actuators A: Physical:

JUL - SEP 2007: Top 14

JAN - MAR 2007: Top 15

·         In Microelectronic Engineering:

OCT - DEC 2006: Top 22

·         In Microelectronics Journal:

OCT - DEC 2006: Top 19

APR - JUN 2006: Top 12

JAN - MAR 2006: Top 4

JUL - SEP 2005: Top 12

OCT - DEC 2005: Top 21

APR - JUN 2005: Top 23

Our papers have been the most downloaded popular articles in Soldering & Surface Mount Technology

Top 8, Top 11 during 2007; Top 10, Top 12 during 2007 (JAN-SEP 2007); Top 11, Top 20 during 2007 (JAN-JUN 2007); Top 16 during 2006

Top 8 since 2001 (monitoring began) to JAN 2008; Top 12 since 2001 (monitoring began) to OCT 2007; Top 15 since 2001 (monitoring began) to JUL 2007; Top 20 since 2001 (monitoring began) to MAR 2007

Top 20 by Immediate Impact (updated in OCT 2007); Top 18 by Immediate Impact (updated in JUL 2007); Top 14 by Immediate Impact (updated in APR 2007)

Our paper has been the most downloaded popular articles in Microelectronics International

Top 2 by Immediate Impact (updated in JAN 2008); Top 15 by Immediate Impact (updated in OCT 2007); Top 18 during 2007

 

SELECTED JOURNAL PAPERS (NTU library members/users may want to view the papers in the list by clicking here)

1.            K.B. Mustapha, Z.W. Zhong, Wave propagation characteristics of a twisted micro scale beam, International Journal of Engineering Science 53 (2012) 46–57.

2.            K.B. Mustapha, Z.W. Zhong, Stability of single-walled carbon nanotubes and single-walled carbon nanocones under self-weight and an axial tip force, International Journal of Engineering Science 50 (1) (2012) 268-278.

3.            Z.W. Zhong, Overview of wire bonding using copper wire or insulated wire, Microelectronics Reliability 51 (1) (2011) 4-12. The most frequently downloaded journal article in Microelectronics Reliability during JAN - MAR 2011: Top 1

4.            Z.W. Zhong, X C Shan, S J Wong, Roll-to-roll large-format slot die coating of photosensitive resin for UV embossing, Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems 17 (12) (2011) 1703-1711.

5.            Y.B. Tian, L. Zhou, Z W Zhong, H. Sato, J. Shimizu, Finite element analysis of deflection and residual stress on machined ultra-thin silicon wafers, Semiconductor Science and Technology, 26 (2011) 105002 doi:10.1088/0268-1242/26/10/105002.

6.            Z.W. Zhong, B. Song, P.E. Loh, LCAs of a polycrystalline photovoltaic module and a wind turbine, Renewable Energy 36 (8) (2011) 2227-2237.

7.            M.C.G. Lim, Z.W. Zhong, Dynamical behavior of copper atoms in a carbon nanotube channel, Carbon 49 (3) (2011) 996-1005.

8.            M.C.G. Lim, Z.W. Zhong, The junction size effect on the electromigration flow of copper atoms through carbon-nanotube junctions, Physica E 43 (4) (2011) 862-868.

9.            M.C.G. Lim, Z.W. Zhong, Effects of electromigration on copper atoms in carbon nanotube channels, Physica A 390 (5) (2011) 963-971.

10.        Z.W. Zhong, M.H. Leong, X.D. Liu, The wear rates and performance of three mold insert materials, Materials & Design 32 (2) (2011) 643-648.

11.        J.H Zhou, C.K. Pang, F.L. Lewis, Z.W. Zhong, Dominant Feature Identification for Industrial Fault Detection and Isolation Applications, Expert Systems With Applications 38 (8) (2011) 10676-10684.

12.        J.H. Zhou, C.K. Pang, Z.W. Zhong, F.L. Lewis, Tool Wear Monitoring Using Acoustic Emissions by Dominant-Feature Identification, IEEE Transactions on Instrumentation and Measurement 60 (2) (2011) 547-559.

13.        K.B. Mustapha, Z.W. Zhong, The thermo-mechanical vibration of a single-walled carbon nanotube studied using the Bubnov–Galerkin method, Physica E 43 (1) (2010) 375-381.

14.        K.B. Mustapha, Z.W. Zhong, Free transverse vibration of an axially loaded non-prismatic single-walled carbon nanotube embedded in a two-parameter elastic medium, Computational Materials Science 50 (2) (2010) 742-751.

15.        M.C.G. Lim, Z.W. Zhong, Atomic arrangement of copper atoms in a carbon nanotube channel under electromigration conditions, Chemical Physics Letters 500 (1-3) (2010) 49–53.

16.        Z.W. Zhong, B. Song, M.B.M. Zaki, Life-cycle assessment of flash pyrolysis of wood waste, Journal of Cleaner Production 18 (12) (2010) 1177-1183.

17.        B. Lotfi, Z.W. Zhong, L.P. Khoo, A novel algorithm to generate backlash-free motions, Mechanism and Machine Theory 45 (8) (2010) 1171-1184.

18.        L.Y. Zhai, L.P. Khoo, Z.W. Zhong, Towards a QFD-based expert system: A novel extension to fuzzy QFD methodology using rough set theory, Expert Systems with Applications 37 (12) (2010) 8888-8896.

19.        L P Yeo, S H Ng, Z F Wang, H M Xia, Z P Wang, V S Thang, Z W Zhong, N F de Rooij, Investigation of hot roller embossing for microfluidic devices, Journal of Micromechanics and Microengineering 20 (1) (2010) 015017 (10pp) doi:10.1088/0960-1317/20/1/015017 Online at stacks.iop.org/JMM/20/015017.

20.        Z.W. Zhong, X.C. Shan, Y.C. Yao, Investigation of antiadhesive coatings for nanoimprinting lithography, Materials and Manufacturing Processes 25 (7) (2010) 658-664.

21.        M.C.G. Lim, Z.W. Zhong, Effects of fluid flow on the oligonucleotide folding in single-walled carbon nanotubes, Physical Review E 80 (4) (2009) 041915-1−041915-8. DOI: 10.1103/PhysRevE.80.041915.

22.        J.H Zhou, C.K. Pang, F.L. Lewis, Z.W. Zhong, Intelligent Diagnosis and Prognosis of Tool Wear Using Dominant Feature Identification, IEEE Transactions on Industrial Informatics, 5 (4) (2009) 454-464.

23.        Z.W. Zhong, T.Y. Tee, Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs, Proceedings of the IEEE 97 (1) (2009) 175-183 INVITED PAPER. (Proceedings of the IEEE is an SCI journal with an Impact Factor of 4.878 in 2009 and a 5-Year Impact Factor of 6.039 in 2009, an Impact Factor of 4.613 in 2008 and a 5-Year Impact Factor of 6.824 in 2008, Top-2 journal in 2009 out of 245, Top-5 journal in 2008 and Top-1 in 2007 out of 229 SCI journals in subject categories of Engineering, Electrical & Electronic).

24.        B. Lotfi, Z.W. Zhong, L.P. Khoo, Prediction of cutting forces along Pythagorean-hodograph curves, International Journal of Advanced Manufacturing Technology 43 (9-10) (2009) 872-882.

25.        M.C.G. Lim, Z.W. Zhong, Molecular dynamics analyses of an Al(110) surface, Physica A 388 (19) (2009) 4083-4090.

26.        M. Xie, Z.W. Zhong, L. Zhang, L.B. Xian, L. Wang, H.J. Yang, C.S. Song, J. Li, A Deterministic Way of Planning and Controlling Biped Walking of LOCH Humanoid Robot, Industrial Robot 36 (4) (2009) 314-325.

27.        Z.W. Zhong, Fine and ultra-fine pitch wire bonding: challenges and solutions, Microelectronics International 26 (2) (2009) 10-18.

28.        N.G. Shankar, N. Ravi, Z.W. Zhong, A Real-Time Print-Defect Detection System for Web Offset Printing, Measurement 42 (5) (2009) 645-652.

29.        L.Y. Zhai, L.P. Khoo, Z.W. Zhong, A rough set based QFD approach to the management of imprecise design information in product development, Advanced Engineering Informatics 23 (2) (2009) 222-228.

30.        Z.W. Zhong, B. Song, C.X. Huang, Environmental impacts of three polyhydroxyalkanoate (PHA) manufacturing processes, Materials and Manufacturing Processes 24 (5) (2009) 519-523.

31.        Z.W. Zhong, V.C. Venkatesh, Recent developments in grinding of advanced materials, International Journal of Advanced Manufacturing Technology 41 (5-6) (2009) 468-480.

32.        J.H. Zhou, Z.W. Zhong, M. Luo, C. Shao, Wavelet-based correlation modelling for health assessment of fluid dynamic bearings in brushless DC motors, International Journal of Advanced Manufacturing Technology 41 (5-6) (2009) 421-429.

33.        L.Y. Zhai, L.P. Khoo, Z.W. Zhong, A rough set based decision support approach to improving consumer affective satisfactions in product design, International Journal of Industrial Ergonomics 39 (2) (2009) 295-302.

34.        L.Y. Zhai, L.P. Khoo, Z.W. Zhong, Design concept evaluation in product development using rough sets and grey relation analysis, Expert Systems with Applications 36 (3) (2009) 7072-7079.

35.        Z.W. Zhong, Wire bonding using copper wire, Microelectronics International 26 (1) (2009) 10-16.

36.        B. Lotfi, Z.W. Zhong, L.P. Khoo, Variable feed rates and variable machine forces for a constant material removal rate and constant cutting force along Pythagorean-hodograph curves, International Journal of Advanced Manufacturing Technology 40 (1-2) (2009), 171–178.

37.        L.P. Zhao, N. Bai, X. Li, Z.P. Fang, Z.W. Zhong, A.A. Hein, Improving the system stability of a digital Shack–Hartmann wavefront sensor with a special lenslet array, Applied Optics 48 (1) (2009) A71-A74.

38.        L.Y. Zhai, L.P. Khoo, Z.W. Zhong, A dominance-based rough set approach to Kansei Engineering in product development, Expert Systems with Applications 36 (1) (2009) 393-402.

39.        Z.W. Zhong, Recent advances in polishing of advanced materials, Materials and Manufacturing Processes 23 (5) (2008) 449-456.

40.        Z.W. Zhong, Wire bonding of low-k devices, Microelectronics International 25 (3) (2008) 19-25.

41.        Z.W. Zhong, Wire bonding using insulated wire and new challenges in wire bonding, Microelectronics International 25 (2) (2008) 9-14.

42.        M.C.G. Lim, Q.X. Pei, Z.W. Zhong, Translocation of DNA oligonucleotide through carbon nanotube channels under induced pressure difference, Physica A 387 (13) (2008) 3111-3120.

43.        L.Y. Zhai, L.P. Khoo, Z.W. Zhong, A rough set enhanced fuzzy approach to quality function deployment, International Journal of Advanced Manufacturing Technology 37 (5-6) (2008) 613-624.

44.        Z.W. Zhong, P. Arulvanan, C.K. Goh, Effects of four key process variables on size shrinkages of low temperature co-fired ceramic substrates, Materials and Manufacturing Processes 23 (1) (2008) 21-28.

45.        M.K. Sakharkar, P. Li, Z. Zhong, K.R. Sakharkar, Quantitative analysis on the characteristics of targets with FDA approved drugs, International Journal of Biological Sciences 4 (1) (2008) 15-22. http://www.biolsci.org/v04p0015.htm.

46.        Zhong Z.W., Z.F. Peng, N. Liu, Surface Roughness Characterization of Thermally Sprayed and Precision Machined WC-Co and Alloy-625 Coatings, Materials Characterization 58 (10) (2007) 997-1005.

47.        Z.W. Zhong, Z.F. Wang, B.M.P. Zirajutheen, Y.S. Tan, Y.H. Tan, Polishing of poly(methyl methacrylate), polycarbonate, and SU-8 polymers, Materials Science-Poland, 25 (1) (2007) 103-112.

48.        Z.W. Zhong, P. Arulvanan, H.P. Maw, C.W.A. Lu, Characterization of SnAgCu and SnPb solder joints on low temperature co-fired ceramic substrate, Soldering & Surface Mount Technology 19 (4) (2007) 18-24.

49.        Z.W. Zhong, T.Y. Tee, J.-E. Luan, Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging, Microelectronics International, 24 (3) (2007) 18-26.

50.        Z.W. Zhong, S.Y. Chan, Investigation of a Gripping Device Actuated by SMA Wire, Sensors and Actuators A: Physical 136 (1) (2007) 335-340.

51.        J.E. Luan, T.Y. Tee, E. Pek, C.T. Lim, Z. Zhong, Dynamic responses and solder joint reliability under board level drop test, Microelectronics Reliability 47 (2-3) (2007) 450-460.

52.        K.S. Goh, Z.W. Zhong, Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding, Microelectronic Engineering 84 (2) (2007) 362-367.

53.        Z.W. Zhong, H.M. Ho, Y.C. Tan, W.C. Tan, H.M. Goh, B.H. Toh, J. Tan, Study of factors affecting the hardness of ball bonds in copper wire bonding, Microelectronic Engineering 84 (2)  (2007) 368-374.

54.        S.K. Nah, Z.W. Zhong, A microgripper using piezoelectric actuation for micro-object manipulation, Sensors and Actuators A: Physical 133 (1) (2007) 218–224.

55.        K.S. Goh, Z.W. Zhong, A new bonding-tool solution to improve stitch bondability, Microelectronic Engineering 84 (1) (2007) 173-179.

56.        Z.W. Zhong, Z.F. Peng, Fractal roughness structures of precision-machined WC-Co- and Inconel 625-coated steel rods, The International Journal of Advanced Manufacturing Technology 33 (9-10) (2007) 885-890.

57.        P. Arulvanan, Z.W. Zhong, Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder, Microelectronic Engineering 83 (11-12) (2006) 2462-2468.

58.        N.G. Shankar and Zhong, Z.W., Improved Segmentation of Semiconductor Defects using Area Sieves, Machine Vision and Applications, Vol. 17, No. 1, 2006, pp. 1-7.

59.        Zhong Z.W. and G. Lin, Ultrasonic Assisted Turning of an Aluminium-Based Metal Matrix Composite Reinforced with SiC Particles, The International Journal of Advanced Manufacturing Technology, Vol. 27, Nos. 11-12, 2006, pp. 1077-1081.

60.        J.E. Luan, T.Y. Tee, E. Pek, C.T. Lim, Z. Zhong, J. Zhou, Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability during Drop Impact, IEEE Transactions on Components and Packaging Technologies 29 (3) (2006) 449-456.

61.        T. Y. Tee, H.S. Ng and Zhong Z., "Board Level Solder Joint Reliability Analysis of Stacked Die Mixed Flip-Chip and Wirebond BGA," Microelectronics Reliability 46 (12) (2006) 2131-2138.

62.        K.S. Goh, and Zhong Z.W., “Development of capillaries for wire bonding of low-k ultra-fine-pitch devices,” Microelectronic Engineering, Vol. 83, No. 10, 2006, pp. 2009-2014.

63.        T.Y. Tee, H.S. Ng, Zhong Z. and J. Zhou, "Board-Level Solder Joint Reliability Analysis of Thermally Enhanced BGAs and LGAs," IEEE Transactions on Advanced Packaging, Vol. 29, No. 2, May 2006, pp. 284-290.

64.        Zhong Z.W. L.P. Khoo and S.T. Han, “Prediction of surface roughness of turned surfaces using neural networks,” The International Journal of Advanced Manufacturing Technology, Vol. 28, Nos. 7-8, 2006, pp. 688-693.

65.        Zhong Z.W., L.P. Zhao, H.H. Lin, “Development and investigation of an optical tilt sensor,” Optics Communications, 261/1 2006, pp. 23-28.

66.        N.G. Shankar and Zhong, Z.W., “A Rule-Based Computing Approach for the Segmentation of Semiconductor Defects,” Microelectronics Journal, Vol. 37, No. 6, 2006, 500-509.

67.        Zhong, Z.W., C.K. Yeong, “Development of a Gripper Using SMA Wire,” Sensors and Actuators A: Physical, Vol. 126, No. 2, 2006, pp. 375-381.

68.        Zhong Z.W., and K.S. Goh, “Investigation of ultrasonic vibrations of wire-bonding capillaries,” Microelectronics Journal, Vol. 37, No. 2, 2006, pp. 107-113.

69.        Arulvanan P., Zhong Z. and X. Q. Shi, “Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints,” Microelectronics Reliability, Vol. 46, Nos. 2-4, 2006, pp. 432-439.

70.        Zhong, Z.W.; Wang, Z.F.; Tan, Y.H., Chemical Mechanical Polishing of Polymeric Materials for MEMS Applications,” Microelectronics Journal, Vol. 37, No. 4, 2006, pp. 295-301.

71.        Zhong Z.W., Arulvanan P., X.Q. Shi, Lead-free PCB Assembly and Effects of Process Conditions on the Profile and Reliability of Solder Joints, Soldering & Surface Mount Technology, Vol. 17, No. 4, 2005, pp. 33-37.

72.        N.G. Shankar, and Zhong, Z.W., “A New Rule-Based Clustering Technique for Defect Analysis,” Microelectronics Journal, Vol. 36, No. 8, 2005, pp. 718-724.

73.        Zhong Z.W. and Z.Y. Rui, “Grinding of Single-Crystal Silicon Using a Micro-Vibration Device,” Materials and Manufacturing Processes, Vol. 20, No. 4, 2005, pp. 687-696.

74.        Zhong Z.W. and G. Lin, “Diamond Turning of a Metal Matrix Composite with Ultrasonic Vibrations,” Materials and Manufacturing Processes, Vol. 20, No. 4, 2005, pp. 727-735.

75.        J. Tan, Z.W. Zhong, and H. M. Ho, “Wire Bonding Process Development for Low-k Materials,” Microelectronic Engineering, Vol. 81, No. 1, 2005, pp. 75-82.

76.        N.G. Shankar and Zhong, Z.W., “Defect Detection on Semiconductor Wafer Surfaces,” Microelectronic Engineering, 77/3-4, 2005, pp. 337-346.

77.        Zhong Z.W., “Various adhesives for flip chips,” ASME Journal of Electronic Packaging, Vol. 127, Issue 1, Mar. 2005, pp. 29-32.

78.        Zhong Z.W., S. C. Lim, and A. Asundi, “Optical fiber shifts and shear strains in V-groove arrays for optical MEMS packaging,” ASME Journal of Electronic Packaging, Vol. 127, Issue 1, Mar. 2005, pp. 25-28.

79.        Zhong Z.W., Z.F. Wang, and Zirajutheen B.M.P., “Chemical mechanical polishing of polycarbonate and poly methyl methacryate substrates,” Microelectronic Engineering, Vol. 81, No. 1, 2005, pp. 117-124.

80.        Zhong Z.W., S. C. Lim, and A. Asundi, “Effects of thermally induced optical fiber shifts in V-groove arrays for optical MEMS,” Microelectronics Journal, Volume 36, Issue 2, 2005, pp. 109-113.

81.        Zhong, Z.W., and Lu Y.G., An AFM Scanning Moire Technique for the Inspection of Surface Deformations, The International Journal of Advanced Manufacturing Technology, Vol. 23, Nos. 5-6, March 2004, pp. 462-466.

82.        Zhong, Z.W. and H. B. Yang, “Development of a vibration device for grinding with microvibration”, Materials and Manufacturing Processes, Vol. 19, No. 6, 2004, pp. 1121-1132.

83.        Zhong Z.W. and T. M. Lye, “Effects of Profiles and Conditioning Methods of Heater Surfaces on Deposited TiN Film Thickness and Uniformity,” Microelectronic Engineering, Vol. 75, No. 4, 2004, pp. 405-412.

84.        Tee T.Y. and Zhong Z., “Board Level Solder Joint Reliability Analysis and Optimization of Pyramidal Stacked Die BGA Packages”, Microelectronics Reliability, Vol. 44, No. 12, 2004, pp. 1957-1965.

85.        Zhong, Z.W., K.W. Wong and X.Q. Shi, “Interfacial behaviour of a flip chip structure under thermal testing,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, No. 1, 2004, pp. 43-48.

86.        Zhong Z.W. and S. H. Gee, “Failure Analysis of Ultrasonic Pitting and Carbon Voids on Magnetic Recording Disks”, Ceramics International, 30/7, 2004, pp. 1619-1622.

87.        Zhong Z.W., “Thermal Strain Analysis of IC Packages Using Various Moiré Methods,” Microelectronics International, Vol. 21, No. 3, 2004, pp. 25–28.

88.        T. Y. Tee, H.S. Ng, C.T. Lim, E. Pek, and Zhong, Z., “Impact Life Prediction Modeling of TFBGA Packages under Board Level Drop Test”, Microelectronics Reliability, Vol. 44, No. 7, 2004, pp. 1131-1142.

89.        Zhong, Z.W. and Y. Jiang, “LED lighting configurations for visual inspection of IC packages”, Materials and Manufacturing Processes, Vol. 19, No. 3, 1 July 2004, pp. 439-449.

90.        Tee, T. Y. and Zhong, Z., “Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of QFN Package during Reflow with Interfacial Fracture Mechanics Analysis”, Microelectronics Reliability, Vol. 44, No. 1, 2004, pp. 105-114.

91.        Gan, J., Wang, X., Zhou, M., Ngoi B., and Zhong, Z., Ultraprecision Diamond Turning of Glass with Ultrasonic Vibration, The International Journal of Advanced Manufacturing Technology, Vol. 21, Vol. 12, 2003, pp. 952-955.

92.        Zhong, Z.W., and Zheng, Z., “Head-Disk Interfacial Behavior in Glide Tests for Manufacturing Hard Disks,” Materials and Manufacturing Processes, Vol. 18, No. 1, 2003, pp. 123-134.

93.        Zhong, Z.W., “Grinding of Aluminum-Based Metal Matrix Composites Reinforced with Al2O3 or SiC Particles,” The International Journal of Advanced Manufacturing Technology, 21 (2003) 2, pp. 79-83.

94.        Zhong Z.W. and T. M. Lye, “Effects of heater surface pre-coating and plasma treatment on deposited TiN film thickness,” Surface Engineering, 2003, vol. 19, no. 4, pp. 274-278.

95.        Zhong, Z.W., and W.H. Tok, "Grinding of Single-Crystal Silicon Along Crystallographic Directions", Materials and Manufacturing Processes, Vol. 18, No. 5, 2003, pp. 811-824.

96.        Zhong Z.W. and S. K. Nah, “Thermal strain analysis of an electronics package using the SEM moiré technique,” Soldering & Surface Mount Technology, Vol. 15, No. 3, 2003, pp. 33-35.

97.        K.C. Chan, Teo M. and Zhong, Z.W., “Characterization of Low-k Benzocyclobutene Dielectric Thin Film,” Microelectronics International, Vol. 20, No. 3, 2003, pp. 11-22.

98.        Tee, T. Y., H. S. Ng, D. Yap, Zhong, Z., “Comprehensive Board Level Solder Joint Reliability Modeling and Testing of QFN and PowerQFN Packages”, Microelectronics Reliability, 43(8), pp. 1329-1338.

99.        Zhong, Z.W., “Ductile or Partial Ductile Mode Machining of Brittle Materials,” The International Journal of Advanced Manufacturing Technology, Vol. 21, No. 8, 2003, pp. 579-585.

100.    Tee, T. Y., H. S. Ng, D. Yap, X. Baraton, Zhong, Z., “Board Level Solder Joint Reliability Modeling and Testing of TFBGA Packages for Telecommunication Applications”, Microelectronics Reliability, Vol. 43(7), pp. 1117-1123.

101.    Zhong, Z.W., and Zheng Z., “Flying Height Deviations in Glide Height Tests,” Sensors and Actuators A: Physical, Vol. 105, No. 3, 2003, pp. 255-260.

102.    Zhong, Z., Yip, P.K., Finite element analysis of a three dimensional package, Soldering & Surface Mount Technology, Vol. 15, No. 1, 2003, pp. 21-25.

103.    Chan K.C., Zhong Z.W., and Ong K.W., “Study of under bump metallization barrier layer for lead-free solder,” Soldering & Surface Mount Technology, Vol. 15, No. 2, 2003, pp. 46-52.

104.    Ramesh K., Yeo S.H., Zhong, Z.W., and Huang H., “Ecological grinding with chilled air as coolant”, Proceedings of the Institution of Mechanical Engineers. Part B, Journal of Engineering Manufacture, Vol. 217 (3), 2003, pp. 409-419.

105.    Zhong Z.W., and Lu Y.G., "Fractal roughness structure of diamond-turned copper mirrors", Materials and Manufacturing Processes, Vol. 18, No. 2, 2003, pp. 219-227.

106.    Tee, T. Y., C. L. Kho, D. Yap, C. Toh, X. Baraton, Zhong, Z., “Reliability Assessment and Hygroswelling Modeling of FCBGA with No-flow Underfill”, Microelectronics Reliability, Vol 43(5), pp. 741-749.

107.    Ramesh K., Yeo S.H., Zhong, Z.W., and Yui A. “Ultra-High-Speed Behavior of a Rolling Element upon using Oil-Air Mist Lubrication,” Journal of Materials Processing Technology, Vol. 127, 2002, pp. 191-198.

108.    Xie, H.M., Asundi, A., Chai, G.B., Lu, Y.G., Yu J.,. Zhong, Z., “High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package,” Microelectronics Reliability, 42 (8), 2002, pp. 1219 –1227.

109.    Zhong, Z.W., and Han, Z.Z., “Turning of Glass with Abrasive Waterjet,” Materials and Manufacturing Processes, Vol. 17, No.3, 17 June 2002, pp. 339-349.

110.    Yeo S.H., Ramesh K., and Zhong, Z.W., “Ultra-high-speed grinding spindle characteristics upon using oil/air mist lubrication”, International Journal of Machine Tools and Manufacture 42 (7) (2002) pp. 815-823.

111.    Zhong, Z.W., and Lu Y.G., “3D Characterization of Super-Smooth Surfaces of Diamond Turned OFHC Copper Mirrors,” Materials and Manufacturing Processes, Vol. 17, No. 2, 1 May 2002, pp. 269-280.

112.    Zhong, Z., and Hung, N.P., “Grinding of Alumina/Aluminum Composites,” Journal of Materials Processing Technology, Vol. 123, No. 1, 2002, pp. 13-17.

113.    Zhong, Z., “Surface Finish of Precision Machined Advanced Materials,” Journal of Materials Processing Technology, Vol. 122, No. 2-3, 2002, pp. 173-178.

114.    Zhou, M., Ngoi B.K.A., and Zhong, Z.W., Wang X.J., The Effect of Material Microstructure on Microcutting Processes, Materials and Manufacturing Processes, Vol. 16, No. 6, Nov. 2001, pp. 815-828.

115.    Zhou, M., Ngoi B.K.A., Zhong, Z.W., and Chin, C.S. Brittle-Ductile Transition in Diamond Cutting of Silicon Single Crystals, Materials and Manufacturing Processes, Vol. 16, No. 4, 2001, pp. 447-460.

116.    Zhong Z.W., and Lee W. Y. “Grinding of Silicon and Glass Using a New Dressing Device and an Improved Coolant System,” Materials and Manufacturing Processes, Vol. 16, No. 4, 2001, pp. 471-482.

117.    Zhong, Z., “Stud bump bond packaging with reduced process steps,” Soldering & Surface Mount Technology, Vol. 13, No. 2, 2001, pp. 35-38.

118.    Zhong, Z., “Reliability of FCOB with and without encapsulation,” Soldering & Surface Mount Technology, Vol. 13, No. 2, 2001, pp. 21-25.

119.    Ramesh K., Yeo S.H., Zhong, Z.W., and Sim, K.C., “Coolant shoe development for high efficiency grinding,” Journal of Materials Processing Technology, Vol. 114, 2001, pp. 240-245.

120.    Zhong, Z., Ramesh K., and Yeo S.H. “Grinding of Nickel-Based Super-Alloys and Advanced Ceramics,” Materials and Manufacturing Processes, Vol. 16, No. 2, March 2001, pp. 195-207.

121.    Zhong, Z., “Flip chip assemblies using gold bumps and adhesive,” Microelectronics International, Vol. 18, No. 3, Sep. 2001, pp. 15-19.

122.    Lu, Y.G., Zhong, Z.W., Yu J., Xie, H.M., Chai, J.B., and Asundi, A., “Thermal Deformation Measurement of Electronic Packages Using Atomic Force Microscope Scanning Moiré Technique,” Review of Scientific Instruments, Vol. 72, No. 4, American Institute of Physics, April 2001, pp. 2180-2185.

123.    Zhong, Z., “Machining of Thermally Sprayed WC-Co Coatings,” Materials and Manufacturing Processes, Vol. 16, No. 1, Jan. 2001, pp. 103-112.

124.    Zhong, Z., and K. S. Goh, “Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding,” Journal of Electronics Manufacturing, Vol. 10, No. 4, Dec. 2000, pp. 211-217.

125.    Zhong, Z., and K. S. Goh, “Flip Chip on FR-4, Ceramics and Flex,” Journal of Electronics Manufacturing, Vol. 10, No. 2, June 2000, pp. 89-96.

126.    Zhong, Z., and Hung, N.P., “Diamond Turning and Grinding of Aluminum-Based Metal Matrix Composites,” Materials and Manufacturing Processes, Vol. 15, No. 6, Nov. 2000, pp. 853-865.

127.    Hung, N.P., T. C. Tan, Zhong, Z.W., and G. W. Yeow, “Ductile-regime machining of particle-reinforced metal matrix composites,” Machining Science and Technology, Vol. 3, Issue 2, Dec. 1999, pp. 255-271.

128.    Hung NP, Zhong, Z.W., Lee K.K. and Chai C.F. “Precision Grinding and Facing of Copper-Beryllium Alloys,” Precision Engineering - Journal of ASPE, Vol. 23, No.4, Oct. 1999, pp.293-304.

129.    Zhong, Z., “Assembly and Reliability of Flip Chip on Boards Using ACAs or Eutectic Solder with Underfill,” Microelectronics International, Vol. 16, No. 3, Sep. 1999, pp. 6-14.

130.    Zhong, Z., “Grinding of Toroidal and Cylindrical Surfaces on SiC Using Diamond Grinding Wheels,” Materials and Manufacturing Processes, Vol. 12, No. 6, 1997, pp. 1049-1062.

131.    Hung NP, Zhong, Z.W., Zhong CH, “Grinding of Metal Matrix Composites Reinforced with Silicon-Carbide Particles,” Materials and Manufacturing Processes, Vol. 12, No. 6, 1997, pp. 1075-1091.

132.    Venkatesh, V.C., Zhong, Z., and Wihardjo, E., "Studies on Polishing of Glass Moulds after Lapping with Hard and Soft Pellets," Journal of Materials Processing Technology, Vol. 62, No. 4, Dec. 1996, pp. 415-420.

133.    Zhong, Z., and Nakagawa, T., "Grinding of Aspherical SiC Mirrors," Journal of Materials Processing Technology, Vol.56, Nos.1-4, Jan. 1996, pp. 37-44.

134.    Zhong, Z., and Venkatesh, V.C., "Semi-Ductile Grinding and Polishing of Ophthalmic Aspherics and Spherics," Annals of CIRP, VOL.44/1, 1995, pp.339-342.

135.    Zhong, Z., and Venkatesh, V.C., "Generation of parabolic and toroidal surfaces on silicon and silicon based compounds using diamond cup grinding wheels," Annals of CIRP, VOL.43/1, 1994, pp.323-326.

136.    Zhong, Z., and Venkatesh, V.C., "Surface Integrity Studies on the Grinding, Lapping and Polishing Processes for Optical Products," Journal of Materials Processing Technology, Vol.44, Nos.3-4, Aug. 1994, pp.179-186.

137.    Zhong, Z., "New Grinding Methods for Aspheric Mirrors with Large Curvature Radii," Annals of CIRP, VOL. 41/1, 1992, pp. 335-338.

138.    Zhong, Z.W., and Nakagawa, T., Development of a Micro-Displacement Table for Ultra-Precision Machining and Grinding for Curved Surfaces by the Use of It, International Journal of the Japan Society for Precision Engineering, Vol.26, No.2, June 1992, pp. 102-107.

 

SELECTED BOOK CHAPTERS

1.      L. P. Khoo, Zhong, Z.W., and H. Y. Lim, Maintenance Planning Using Enterprise Data Mining, Recent Advances in Data Mining of Enterprise Data, Edited by T.W. Liao and E. Triantaphyllou, World Scientific, Singapore, 2008, pp. 505-544.

2.       L.P. Khoo, Zhong, Z., and H.Y. Lim, “A Rough Set Based Tabu-Enhanced Genetic Algorithm Approach to Rule Induction,” Evolutionary Algorithms and Intelligent Tools in Engineering Optimization, Edited by W. Annicchiarico, J. Périaux, M. Cerrolaza and G. Winter, jointly published by CIMNE, Barcelona, Spain and WIT Press, Billerica, MA, 2005, pp. 141-166.

3.      Zhong, Z., "Image Scanners," Wiley Encyclopedia of Electrical and Electronics Engineering, Edited by J.G. Webster, John Wiley & Sons, USA, Vol. 9, 1999, pp. 634-642.

 

SELECTED INTERNATIONAL CONFERENCE PAPERS (NTU library members/users may want to view the papers in the list by clicking here)

1.      C.K. Pang, J.-H. Zhou, Z.-W. Zhong, F.L. Lewis, (Invited Paper) "Industrial Fault Detection and Isolation Using Dominant Feature Identification," The 8th Asian Control Conference (ASCC 2011), Kaohsiung, Taiwan, May 15-18, 2011, pp. 1018-1023. Won The Best Application Paper Award.

2.       J.-H Zhou, D.H. Zhang, S.A. Arogeti, M. Luo, D.W. Wang, Z.-W. Zhong, “iDiagnosis & Prognosis - An Intelligent Platform for Complex Manufacturing,” in Proceedings of the 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), WB5.3, pp. 405-410, Singapore, July 14-17, 2009.

3.      C.K. Pang, J.-H Zhou, F.L. Lewis, Z.-W. Zhong, “Tool Wear Forecast Using Singular Value Decomposition for Dominant Feature Identification," in Proceedings of the 2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), WB5.6, pp. 421-426, Singapore, July 14-17, 2009.

4.      Z.W. Zhong, W. Fan, C.W. Low, Investigation of the performance of micro-thermoelectric coolers, Proceedings of SPIE Vol. 7269, art. no. 72690V, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV, SPIE Smart Materials, Nano- and Micro-Smart Systems Symposium, Melbourne, Australia, 2008.

5.      M. Xie, Z.W. Zhong, L. Zhang, H. J. Yang, C. S. Song, J. Li, L. B. Xian and L. Wang, “Self Learning of Gravity Compensation by Humanoid Robot,” 2008 8th IEEE-RAS International Conference on Humanoid Robots (Humanoids 2008), Daejeon, Korea, 2008.

6.      L. Wang, M. Xie, Z.W. Zhong, H.J. Yang and J. Li, 2008, Design of Dexterous Arm-Hand for Human-Assisted Manipulation, 2008 International Conference on Intelligent Robotics and Applications, Wuhan, China, 2008.

7.      L. Wang, M. Xie, Z.W. Zhong, C. Wang and L. Zhang, “Power Analysis and Structure Optimization in the Design of a Humanoid Robot,” Proceedings of 11th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2008), Portugal, 2008, pp. 55-62.

8.      M. Xie, Z.W. Zhong, L. Zhang, L. B. Xian, L. Wang, H. J. Yang, C. S. Song and J. Li, “A Deterministic Way of Planning and Controlling Biped Walking of LOCH Humanoid Robot,” Proceedings of 11th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2008), Portugal, 2008, pp. 1181-1190. Won The Best Paper Award: Industrial Robot Innovation Award 2008, awarded by Industrial Robot: An International Journal, Emerald.

9.      B. Song, C.X. Huang, Z.W. Zhong, “LCA Modelling and Analysis of PHA Manufacturing by Alternative Processes,” Proceedings of 15th CIRP International Conference on Life Cycle Engineering, Sydney, Australia, 17-19 March 2008, pp. 303-308.

10.  Z.W. Zhong, S.K. Nah and S.H. Tan, “Design and development of micro-gripping devices for manipulation of micro-parts,” Proceedings of 10th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2007), Singapore, 16–18 July, 2007, pp. 599-606.

11.  X. Li, M. Luo, X.W. Yang, Z.W. Zhong, “Application of neural network for prediction of slip free temperature offsets in semiconductor epitaxial process,” Proceedings of The 2nd World Congress on Engineering Asset Management and the 4th International Conference on Condition Monitoring (WCEAM-CM2007), Harrogate, United Kingdom, 11-14 June 2007, pp. 1251-1258.

12.  J.H. Zhou, M. Luo, C. Shao, Z.W. Zhong, “Fluid dynamic bearing wear detection in brushless DC motor using wavelet-based correlation modelling,” Proceedings of The 2nd World Congress on Engineering Asset Management and the 4th International Conference on Condition Monitoring (WCEAM-CM2007), Harrogate, United Kingdom, 11-14 June 2007, pp. 2249-2258.

13.  T. Y. Tee, J.E. Luan, E. Pek, C.T. Lim, and Zhong Z., "Advanced Experimental and Simulation Techniques for Analysis of Dynamic Responses during Drop Impact", 54th ECTC (Electronic Components and Technology) Conference, USA, June 2004, 1088-1094.

14.  Zhong Z.W., T. Y. Tee and K. O. Liew, “Finite Element Analysis of Sequential Processes for Ball Grid Array Packages”, Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003), Singapore, Dec. 2003, pp. 809-814.

15.  T. Y. Tee, H.S. Ng, and Zhong Z.W., "Design for Enhanced Solder Joint Reliability of Integrated Passives Device under Board Level Drop Test and Thermal Cycling Test", Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003), Singapore, Dec. 2003, pp. 210-216.

16.  J.E. Luan, T. Y. Tee, E. Pek, C.T. Lim, and Zhong Z.W., "Modal Analysis and Dynamic Responses of Board Level Drop Test", Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003), Singapore, Dec. 2003, pp. 233-243.

17.  Tee T.Y., Ng H.S., Lim C.T., Pek E. and Zhong Z., “Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications”, 53rd ECTC Conference, USA, May 2003, 121-129.

18.  Tee T.Y., Lim M., Ng H.S., Baraton X., and Zhong Z.W., “Design Analysis and Optimization of Wirebond Stacked Die BGA Packages for Improved Board Level Solder Joint Reliability”, Keynote Paper, Proceedings of the 4th International Conference on Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSIME2003 IEEE, France, 2003, pp. 207-213.

19.  K.C. Chan and Zhong Z.W., “Investigation of CrCu/Cu/Ni Underbump Metallization for Lead-free Applications”, Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002), Singapore, Dec. 2002, pp. 270-275.

20.  Zhong Z.W., Han CP, and Asundi A. “A Study of Parameters Affecting the Sensitivity of a 3-D Measurement System Using the Phase Shifting Technique,” Proceedings of SPIE Vol. 4398, 2001, 182-188.

21.  Asundi, Anand K.; Xie, Huimin; Yu, Jin; Zhong Z.W., “Phase-shifting AFM moire method”, Proceedings of SPIE Volume: 4448, 2001, pp. 102-110.

22.  Zhong Z.W., and Tham, W.W., “A study of surface profile measurement using a CD optical pickup head,” Proceedings of SPIE 2001, Volume 4596, pp. 48-53.

23.  Zhong Z.W., and K. S. Goh, “Finite Element Analysis and Experiments of Ultra-Fine-Pitch Wire Bonding,” Proceedings of SPIE 2000, Volume 4229, pp. 28-35.

 

Editorial Board for international journals

·         Editorial Board of International Journal of Precision Technology (IJPTech)

·         Editorial Advisory Board of international journal: Recent Patents on Engineering

·         Editorial Advisory Board of Recent Patents on Mechanical Engineering

·         Editorial Advisory Board of The Open Nanoscience Journal

·         Editorial Board of International Journal of Computational Materials Science and Surface Engineering (IJCMSSE)

 

Reviewer/referee of international journals

1.      International Journal of Machine Tools & Manufacture

2.      Journal of Materials Processing Technology

3.      International Journal of Advanced Manufacturing Technology

4.      International Journal of Precision Engineering and Manufacturing

5.      International Journal of Production Research (IJPR)

6.      Materials and Manufacturing Processes

7.      Proceedings of the Institution of Mechanical Engineers Part C-Journal of Mechanical Engineering Science

8.      International Journal of Precision Technology

9.      International Journal of Nanomanufacturing (IJNM)

10.  The Open Nanoscience Journal

11.  International Journal of Materials and Product Technology

 

12.  Microelectronic Engineering

13.  Microelectronics Reliability

14.  Microelectronics Journal

15.  Journal of Electronic Packaging (ASME)

16.  Soldering & Surface Mount Technology

 

17.  Sensors and Actuators A-Physical

18.  Sensors (SENSORS-BASEL, MDPI)

19.  Measurement Science and Technology

20.  IEEE/ASME Transactions on Mechatronics

21.  Robotica

22.  International Journal of Robotics & Automation

23.  International Journal of Acoustics and Vibration

24.  International Journal of Automation and Control (IJAAC)

 

25.  Journal of Modern Optics

26.  Optics and Lasers in Engineering

 

27.  Journal of Defense Modeling and Simulation

28.  Neurocomputing

29.  Advances in Engineering Software

30.  International Journal of Information Technology & Decision Making (IJITDM)

31.  Bioinformation

32.  International Journal for Computational Methods in Engineering Science & Mechanics

33.  Mathematical Problems in Engineering

34.  International Transactions in Operational Research

35.  International Journal of Modelling, Identification and Control (IJMIC)

 

36.  Surface and Coatings Technology

37.  Journal of Tribology-Transactions of the ASME

38.  Journal of Alloys and Compounds

39.  Materials Science and Engineering B

40.  Ceramics International

41.  Surface and Interface Analysis

42.  Tribology Letters

 

43.  Journal of Environmental Engineering-ASCE

44.  Physica E

45.  Chemical Engineering Communications

46.  Journal of Zhejiang University-SCIENCE A

47.  International Journal of Sustainable Engineering

48.  Recent Patents on Engineering

49.  Indian Journal of Engineering & Materials Sciences

50.  Songklanakarin Journal of Science and Technology

 

Reviewer/referee of handbooks

51.  Two chapters for Handbook of Research on Nature Inspired Computing for Economy and Management

 

International Committees and International Scientific/Technical Committees of International Conferences:

1.      International Program Committee of the 15th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2012), 23 –25 July 2012, John Hopkins University, Baltimore, USA.

2.      International Program Committee of the 14th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2011), Sep. 6-8, 2011, Paris.

3.      Technical Committee of EuroSimE (Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems) 2011 IEEE conference, EuroSimE 2011, 17-20 April 2011, Linz, Austria.

4.      International Program Committee of the 13th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2010), 31 Aug – 3 September, 2010, Nagoya, Japan.

5.      Technical Committee of EuroSimE (Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems) 2010 IEEE conference, EuroSimE 2010, 26-28 April 2010, Bordeaux, France.

6.      International Program Committee of the 12th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2009), 09 – 11 September, 2009, Istanbul, Turkey.

7.      Publicity Chair of 2nd International Conference on Intelligent Robotics and Applications, 16-18 Dec 2009, Singapore

8.      Technical Committee of EuroSimE (Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems) 2009 IEEE conference, EuroSimE 2009, April 27-29, 2009, Delft, The Netherlands.

9.      International Program Committeeof the 11th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2008), 08 – 10 September, 2008, Coimbra, Portugal.

10.  Technical Committee of EuroSimE (Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems) 2008 IEEE conference, 21-23 April, 2008, Freiburg im Brisgau, Germany.

11.  Program Committee, 9th International Symposium on Laser Metrology, 30 June - 2 July 2008, Singapore.

12.  Program Committee for the 2007 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, IEEE/ASME AIM 2007, ETH Zürich, Switzerland, September 4-7, 2007.

13.  Organizing Committee of the 10th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines (CLAWAR2007), 16 – 18 July 2007, Singapore.

14.  SEMICON Singapore 2007: Technical programmes (Advanced Packaging Technologies Seminars I and II), Singapore, May 2007.

15.  Organizing Committee of the 2007 ASPE (The American Society for Precision Engineering) Spring Topical Meeting: Vibration Assisted Machining Technology, Chapel Hill, NC, USA, 16-17 April 2007.

16.  Technical Committee of EuroSimE (Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems) 2007 IEEE conference, 15-18 April, 2007, London, UK.

17.  The 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2007), Tokyo, Japan, 16-18 January 2007;

18.  The 7th WSEAS International Conference on Evolutionary Computing, Cavtat, Croatia, June 12-14, 2006;

19.  EuroSimE (Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems) 2006 IEEE conference, Como, Milano, Italy, April 23-26, 2006;

20.  SEMICON Singapore 2006: Technical programmes (Advanced Packaging Technologies Seminars I and II), Singapore, May. 2006;

21.  Program Committee (Associate Editor) of 2005 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, 24-28 July 2005, Monterey, California, USA;

22.  The International Workshop on Applied Information Technology 2005, Bangkok, Thailand, 25-26 Nov. 2005;

23.  SEMICON Singapore 2005: Technical programmes (Advanced Packaging Technologies Seminars I and II), Singapore, May. 2005;

24.  6th International Conference on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, 5-7 Dec. 2004;

25.  SEMICON Singapore 2004: Technical programmes (Advanced Packaging Technologies Seminars I and II), Singapore, May. 2004;

26.  SEMICON Singapore 2003: Technical programmes for the semiconductor and flat panel display equipment and materials industries (Advanced Packaging Technologies Seminars I and II), Singapore, Aug. 2003;

27.  International Conference on Precision Engineering (ICoPE) 2000, Singapore, Mar. 2000;

28.  International Conference on Precision Engineering, Singapore, Nov. 1995.

 

OTHER INFORMATION

·         1999-present: Member of Literati Club in the United Kingdom

·         June 2003, named ‘Friend of Emerald’ for June 2003 by Literati Club in the United Kingdom to acknowledge one of their editorial contributors

·         Lian He Zao Bao (Newspaper in Singapore, 12 July 05) reported that my PhD student set a new NTU record to obtain a PhD degree in 2 years, the minimal time required.

·         1993 – 1995, 19th and 20th SME (Society of Manufacturing Engineers) Singapore Chapter Executive Committees, Social Chairman.

·         R&D collaborations with many researchers in research institutes of A*STAR, Singapore, such as Singapore Institute of Manufacturing Technology, Institute of Microelectronics, Institute of High Performance Computing, and Data Storage Institute.

·         R&D collaborations with many companies in Singapore.

·         Having supervised over 105 post-graduate students (Ph.D. Master of Engineering, Master of Science) and over 165 undergraduate Final-Year-Project students.

 

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