The Virtual Wafer Fab Technology for the Deep-Submicron ULSI Era

Xing Zhou

School of Electrical and Electronic Engineering
Nanyang Technological University


This article describes a new technology, the virtual wafer fab technology, which has become increasingly popular in the semiconductor industry for the deep-submicron era.  The first section, Introduction, which is taken from the author’s lecture notes for the 4th-year design course, is intended for readers who are not familiar with the field.  The second section is on the motivation and ideas of the Virtual Wafer Fab and some related concepts.  The last section describes an on-going joint project with the local wafer fab, Project DOUST, its goals, ideas, and potential impact.


© October 1997, X. Zhou.  All rights reserved.