Welcome to homepage of Chen Zhong (陈忠)

School of Materials Science & Engineering

Nanyang Technological University

50 Nanyang Avenue, Singapore 639798

 

 

Chen Zhong

(ResearcherID: A-2244-2011)

 

B.Eng., M.Eng., Ph.D. 

Associate Professor

Tel: +(65) 6790 4256 

Fax:  +(65) 6790 9081
Email: aszchen@ntu.edu.sg

Office: Blk N4.1, level 1, room 24

 

Dr. Chen’s CV in PDF

 

Academic history & Professional experience

Chen Zhong graduated with BEng in Metallurgy & Materials Science in 1984 in China. He started his academic career in 1987 (Assistant Lecturer & Lecturer) right after obtaining his MEng degree in Materials Science and Engineering. In 1992, he was awarded a one-year visiting scholarship by the Ministry of Education of China to work in the University of Reading, U.K. After completing the visit, he was financially supported by the Overseas Research Scholarship (ORS) awarded by the Committee of Vice Chancellors and Principals (CVCP) in the U.K. and an EU research grant to pursue his PhD under the supervision of Prof. Tony Atkins.

 

In April 1997, Dr. Chen came to Singapore to join the newly founded Institute of Materials Research and Engineering (IMRE), a national research institute under the Agency for Science, Technology and Research (A*STAR, formerly known as NSTB) of Singapore government. In March 2000, the passion for teaching brought him back to the education arena to become a faculty member in the Materials Engineering division of the School of Applied Science (The division grew to the current School of Materials Science and Engineering), at the Nanyang Technological University (NTU).

 

Chen Zhong is an editor or member of the editorial board of 6 international journals, and has served as reviewer for more than 50 international journals (e.g. ACS Applied Materials & Interfaces, Acta Materialia, Applied Catalysis A & B, Applied Physics Letter, Materials Science and Engineering A & B, Nanoscale, Scripta Materialia, The Journal of Physical Chemistry, Thin Solid Films). He is an author of over 120 peer-reviewed journal articles, over 160 conference papers/presentations, 3 book chapters and 6 patents.

Teaching

Dr. Chen has taught a number of courses over the years in NTU, including Materials Science, Engineering Materials, Mathematics, Engineering Mathematics, Mechanics of Materials, Materials Structure and Mechanical Behaviour, Fracture Mechanics and Failure Analysis, Advanced Materials Science, Laboratory (for undergraduates), and Materials Laboratory Techniques (for postgraduates). He has supervised over 100 final year project students.

 

*** Final year project students: click here to view a list of available final year projects. In addition, you are welcome to propose your own project of interest.

Research interests

Dr. Chen is interested in applying fundamental materials science to the understanding of material’s behavior and development of new materials. To achieve this, experimental investigation has been complemented by computer simulation at different length scales. In recent years, his research focus is on thin films and nano-structures for nanoelectronics, energy, and environmental applications.

 

Thin Films & Low-dimensional Materials: Thin films & nano-materials for clean energy and environmental applications; Microelectronic thin films; Protective and functional surface coatings.

 

Mechanical Behavior of Materials: Fracture, fatigue, and creep of bulk monolithic & composite materials, thin films and multi-layers; Experimental and computational mechanics.

 

*      Materials and Nanostructures for Energy and Environmental Applications:

·         Synthesis of nanostructured photocatalysts for clean energy and environmental applications: hydrogen fuel production by solar water splitting, degradation and detoxification of organic and inorganic pollutants. Materials for fuel cell and rechargeable batteries. Understanding of the effect of crystal / electronic structures, form factor, and dopants on photocatalytic performance. With the improved understanding, new materials of improved energy utilization efficiency will be synthesized and characterized.

 

*      Micro/Nanoelectronics: Materials, Packaging and Reliability:

·         Application of electroless Ni plating and composite coating as the metallization materials for lead-free solder interconnect and solder-less joining (e.g. NCA and ACA). Fine pitch realization and reliability studies. Surface activation for fine pitch surfaces.

·         Reliability & joining mechanisms of interconnects: Eletromigration, stress migration and thermal migration in solder & Cu interconnect. Interface reactions and long-term reliability of lead-free solder joints and Au/Cu wire bonding.

·         Barrier materials for Cu interconnect: development of future generation Cu diffusion barriers.

 

*      Thin Films and Surface / Interface Engineering:

·         Ni / Cu metallization; Surface protective coating on metals, plastics and ceramics by PVD, CVD, electrochemical (electrolytic & electroless), and sol-gel coatings; Surface modification for improved adhesion and device sealing; Surface and interface characterizations.

 

*      Mechanics of Materials (Bulk & Composite Materials, Thin Films and Multi-layers):

·         Thin film cracking, scratch and delamination, especially at small dimensions. Size effect on the mechanical properties of micro- and nano-structures. Influence of substrate compliance on the mechanical behavior of thin films. Thin film reliability test design and analysis. Thin film adhesion assessment such as peeling and blistering and other testing methodology development.

·         Strength, ductility, fracture and creep of bulk monolithic and composite materials.

Research scholarship & research fellowship

Priority for research scholarship is given to outstanding graduates with background and experience in Materials Science & Engineering, Solid-State Physics, Chemistry or Chemical Engineering, Mechanical Engineering, and other related disciplines leading to a Ph.D. degree. The scholarship offers a monthly stipend of S$2000 (before qualifying and S$2500 after qualifying), and also covers the University tuition fees. The estimated cost of living (including accommodation, food, transport, and other miscellaneous expenses) for a foreign student in Singapore is around S$1200-1700 per month. Successful candidates will be expected to conduct research in the one of the above research areas. Meanwhile, any proposals from potential applicants are welcome.

 

Regular opportunities for postgraduate scholarship:

1.       NTU research scholarship (NTU-RS) leading to PhD degree. Both local and foreign candidates who are interested in working in any of the above areas are welcome to apply.

2.       Singapore international graduate award (SINGA) is open to all international students leading to PhD degree. Please refer to the web site for more details.

3.       A*STAR graduate scholarship (AGS) opens to Singaporeans, Singaporean permanent residents and ASEAN nationals to undertake research at his/her chosen A*STAR research institute and register candidature at either NUS or NTU.

4.       DSO PhD research award provides Singaporean graduates who have achieved excellent academic results in Engineering and Science disciplines, and are keen to apply their knowledge for defence research and development.

 

Research position available:

Information will be posted once a position is available. Please visit the site from time to time.

Selected Publications by Area of Interest (from over 100 peer-reviewed journal publications)

Materials for energy and environmental applications (semiconductor oxide nanostructures for pollutant treatment and hydrogen production, fuel cell and energy storage materials)

1.              O. I. Malyi, P. Wu, V. V. Kulish,  K. W. Bai, Z. Chen “Formation and migration of oxygen and zirconium vacancies in cubic zirconia and zirconium oxysulfide”, Solid State Ionics, doi: 10.1016/j.ssi.2012.01.031

2.              P. Kanhere, J. W. Zheng, Z. Chen “Visible Light Driven Photocatalytic Hydrogen Evolution and Photophysical properties of Bi3+ Doped NaTaO3”, International Journal of Hydrogen Energy, doi: 10.1016/j.ijhydene.2011.12.056

3.              D. G. Gong, W. C. J. Ho, Y. X. Tang, Q. L. Tay, Y. K. Lai, J. G. Highfield, Z. Chen “Silver Decorated Titanate/Titania Nanostructures for Efficient Solar Driven Photocatalysis”, Journal of Solid State Chemistry, doi: 10.1016/j.jssc.2011.11.036

4.              Y. K. Lai, Y. X. Tang, J. J. Gong, D. G. Gong, L. F. Chi, C. J. Lin, Z. Chen “Transparent superhydrophobic / superhydrophilic TiO2-based coatings for self-cleaning and anti-fogging”, Journal of Materials Chemistry, 2012, accepted

5.              Y. X. Tang, P. X. Wee, Y. K. Lai, X. P. Wang, D. G. Gong, P. D. Kanhere, T. T. Lim, Z. L. Dong, Z. Chen “Hierarchical TiO2 Nanoflakes and Nanoparticles Hybrid Structure for Improved Photocatalytic Activity”, The Journal of Physical Chemistry C, 2012, Vol. 116, pp. 2772-2780

6.              Y. X. Tang, Z. L. Jiang, J. Y. Deng, D. G. Gong, Y. K. Lai, H. T. Tay, I. T. K. Joo, T. H. Lau, Z. L. Dong, Z. Chen “Synthesis of Nano-Structured Silver/Silver Halides on Titanate Surfaces and Their Visible Light Photocatalytic Performance”, ACS Applied Materials & Interfaces, 2012, Vol. 4, pp. 438-446

7.              Y. Y. Zhang, Y. X. Tang, S. Y. Yin, Z. Y. Zeng, H. Zhang, C. M. Li, Z. L. Dong, Z. Chen, X. D. Chen “Hierarchical Protonated Titanate Nanostructures for Lithium-ion Batteries”, Nanoscale, 2011, Vol. 3, pp. 4074-4077

8.              O. I. Malyi, Z. Chen, G. G. Shu, P. Wu “Effect of sulfur impurity on the stability of cubic zirconia and its interfaces with metals”, Journal of Materials Chemistry, 2011, Vol. 21, pp. 12363-12368

9.              D. G. Gong, V. P. Subramaniam, J. G. Highfield, Y. X. Tang, Y. K. Lai, Z. Chen “In Situ Mechanistic Investigation at the Liquid/Solid Interface by ATR-FTIR: Ethanol Photo-oxidation over Pristine and Platinized TiO2 (P25)”, ACS Catalysis, 2011, Vol. 1 (8), pp. 864-871

10.          Y. X. Tang, V. P. Subramaniam, T. H. Lau, Y. K. Lai, D. G. Gong, P. D. Kanhere, Y. H. Cheng, Z. Chen, Z. L. Dong “In situ Formation of Large-scale Ag/AgCl Nanoparticles on Layered Titanate Honeycomb by Gas Phase Reaction for Visible Light Degradation of Phenol Solution”, Applied Catalysis B: Environmental, 2011, Vol. 106, pp. 577-585

11.          Y. K. Lai, Y. X. Tang, J. Y. Huang, H. Wang, H. Q. Li, D. G. Gong, X. B. Ji, J. J. Gong, C. J. Lin, L. Sun, Z. Chen “Multi-functional Hybrid Protonated Titanate Nanobelts with Tunable Wettability”, Soft Matter, 2011, Vol. 7, pp. 6313-6319

12.          P. D. Kanhere, J. W. Zheng, Z. Chen “Site Specific Optical and Photocatalytic Properties of Bi Doped NaTaO3”, The Journal of Physical Chemistry C, 2011, Vol. 115, pp. 11846-11853

13.          Y. H. Cheng, Y. Z. Huang, P. D. Kanhere, V. P. Subramaniam, D. G. Gong, S. Zhang, J. Highfield, M. K. Schreyer, Z. Chen “Dual phase titanate/anatase with nitrogen doping for enhanced degradation of organic dye under visible light”, Chemistry – A European Journal, 2011, Vol. 17, pp. 2575-2578

14.          Y. W. L. Lim, Y. X. Tang, Y. H. Cheng, Z. Chen “Morphology, Crystal Structure and Adsorption Performance of Hydrothermally Synthesized Titania and Titanate Nanostructures”, Nanoscale, 2010, Vol. 2, pp. 2751-2757

15.          Y. X. Tang, D. G. Gong, Y. K. Lai, Y. Q. Shen, Y. Y. Zhang, Y. Z. Huang, J. Tao, C. J. Lin, Z. L. Dong, Z. Chen “Hierarchical Layered Titanate Microspherulite: Formation by Electrochemical Spark Discharge Spallation and Application in Aqueous Pollutant Treatment”, Journal of Materials Chemistry, 2010, Vol. 20 (45), pp. 10169-10178

16.          Y. K. Lai, J. Y. Huang, H. F. Zhang, V. P. Subramaniam, Y. X. Tang, D. G. Gong, L. Sundar, L. Sun, Z. Chen, C. J. Lin “Nitrogen-doped TiO2 nanotube array films with enhanced photocatalytic activity under various light sources”, Journal of Hazardous Materials, 2010, Vol. 184, pp. 855-863

17.         Y. X. Tang, Y. K. Lai, D. G. Gong, K.-H. Goh, T.-T. Lim, Z. L. Dong, Z. Chen “Ultrafast Synthesis of Layered Titanate Micro-Spherulite Particles by Electrochemical Spark Discharge Spallation”, Chemistry – A European Journal, 2010, Vol. 16, pp. 7704-7708

18.         Y. K. Lai, H. F. Zhuang, K. P. Xie, D. G. Gong, Y. X. Tang, L. Sun, C. J. Lin, Z. Chen “Fabrication of Ag/TiO2 nanotube array structures with enhanced photoelectrochemical performance”, New Journal of Chemistry, 2010, Vol. 34, pp. 1335-1340

19.         J. W. Zheng, A. Bhattcahrayya, P. Wu, Z. Chen, J. Highfield, Z. L. Dong, R. Xu “The Origin of Visible Light Absorption in Chalcogen Element (S, Se and Te) Doped Anatase TiO2 Photocatalyst”, The Journal of Physical Chemistry C, 2010, Vol. 114 (15), pp. 7063-7069

20.         Y. K. Lai, Z. Q. Lin, Z. Chen, J. Y. Huang, C. J. Lin “Fabrication of patterned CdS/TiO2 heterojunction by wettability template-assisted electrodeposition”, Materials Letters, 2010, Vol. 64 (11), pp. 1309-1312

21.         Y. K. Lai, Y. X. Huang, J. Y. Huang, H. Wang, Z. Chen, C. J. Lin “Selective formation of ordered arrays of octacalcium phosphate ribbons on TiO2 nanotube surface by template-assisted electrodeposition”, Colloids and Surfaces B: Biointerfaces, 2010, Vol. 76 (1), pp. 117-122

22.         X. Yi, J. L. Li, Z. Chen, A. Tok “Single Crystalline InVO4 Nanotubes by Self-Template-Directed Fabrication”, Journal of The American Ceramic Society, 2010, Vol. 93 (2), pp. 596-600

23.         Y. K. Lai, Z. Q. Lin, J. Y. Huang, L. Sun, Z. Chen, C. J. Lin “Controllable construction of ZnO/TiO2 patterning nanostructures by superhydrophilic-superhydrophobic template”, New Journal of Chemistry, 2010, Vol. 34, pp. 44-51

24.         Y. K. Lai, Y. C. Chen, Y. X. Tang, D. G. Gong, Z. Chen, C. J. Lin “Electrophoretic Deposition of Titanate Nanotube Films with Extremely Large Wetting Contrast”, Electrochemistry Communications, 2009, Vol. 11, pp. 2268-2271

25.         Y. K. Lai, J. Y. Huang, J. J. Gong, Y. X. Huang, C. L. Wang, Z. Chen, C. J. Lin “Superhydrophilic–Superhydrophobic Template: A Simple Approach to Micro- and Nanostructure Patterning of TiO2 Films”, Journal of The Electrochemical Society, 2009, Vol. 156 (11), pp. D480-D484

26.         Y. K. Lai, H. F. Zhuang, L. Sun, Z. Chen, C. J. Lin “Self-organized TiO2 Nanotubes in Mixed Organic-inorganic Electrolytes and its Photoelectrochemical Performance”, Electrochimica Acta, 2009, Vol. 54, pp. 6536-6542

27.         J. G. Highfield, M. H. Chen, P. T. Nguyen, Z. Chen “Mechanistic investigations of photo-driven processes over TiO2 by in-situ DRIFTS-MS: Part I: platinization and methanol reforming”, Energy & Environmental Science, 2009, Vol. 2, pp. 991-1002

 

Microelectronic materials (lead-free soldering, gold & copper wire bonding, metallization in electronic packaging, Cu/low-k interface, Cu diffusion barriers, migration & reliability in electronic interconnections)

1.              H. Yan, Y. Y. Tay, Y. Y. Jiang, N. Yantara, J. S. Pan, M. H. Liang, Z. Chen “Copper Diffusion Barrier Performance of Amorphous Ta-Ni Thin Films”, Applied Surface Science, 2012, Vol. 258, pp. 3158-3162

2.              H. Xu, V. L. Acoff, C. Liu, V. V. Silberschmidt, Z. Chen “Facilitating intermetallic formation in wire bonding by applying a pre-ultrasonic energy”, Microelectronic Engineering, 2011, Vol. 88, pp. 3155-3157

3.              H. Xu, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen, V. L. Acoff “Intermetallic phase transformations in Au-Al wire bonds”, Intermetallics, 2011, Vol. 19, pp. 1808-1816

4.              H. Xu, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen, V. L. Acoff “New mechanisms of void growth in Au-Al wire bonds: volumetric shrinkage and intermetallic oxidation”, Scripta Materialia, 2011, Vol. 65, pp. 642-645

5.              H. Xu, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen, V. L. Acoff “Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds”, Acta Materialia, 2011, Vol. 59, pp. 5661-5673

6.              H. Xu, C. Liu, V. Silberschmidt, Z. Chen, V. L. Acoff “Effect of ultrasonic energy on nanoscale interfacial structure in copper wire bonding on aluminium pads”, Journal of Physics D: Applied Physics, 2011, Vol. 44, 145301

7.              H. Xu, C. Liu, V. V. Silberschmidt, Z. Chen, J. Wei, M. Sivakumar “Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: a TEM study of interfacial evolution”, Microelectronics Reliability, 2011, Vol. 51, pp. 113-118

8.              A. Kumar, Z. Chen “Interdependent Intermetallic Compound Growth in an Electroless Ni-P/Sn-3.5Ag Reaction Couple”, Journal of Electronic Materials, 2011, Vol. 40, pp. 213-223

9.              H. Xu, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen, M. Sivakumar, V. L. Acoff “A micromechanism study of thermosonic gold wire bonding on aluminium pad”, Journal of Applied Physics, 2010, Vol. 108 (11), Art. No. 113517

10.          H. Xu, C. Liu, V. V. Silberschmidt, Z. Chen “Growth of intermetallic compounds in thermosonic copper wire bonding on aluminium metallization”, Journal of Electronic Materials, 2010, Vol. 39 (1), pp. 124-131

11.          H. Xu, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen “A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads”, Scripta Materialia, 2009, Vol. 61 (2), pp. 165-168

12.          A. Kumar, Y. Yang, C. C. Wong, V. Kripesh, Z. Chen “Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations”, Journal of Electronic Materials, 2009, Vol. 38 (1), pp. 78-87

13.          Z. Chen, M. He, A. Kumar, G. J. Qi “Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints”, Journal of Electronic Materials, 2007, Vol. 36 (1), pp. 17-25

14.          Z. H. Gan, A. M. Gusak, W. Shao, Z. Chen, S. G. Mhaisalkar, T. Zaporozhets, K. N. Tu, “Analytical Modeling of Reservoir Effect on Electromigration in Cu Interconnects”, Journal of Materials Research, 2007, Vol. 22 (1), pp. 152-156

15.          Z. Chen, A. Kumar, Mona “Effect of Phosphorus Content on Cu/Ni-P/Sn-3.5Ag Solder Joint Strength after Multiple Reflow”, Journal of Electronic Materials, 2006, Vol. 35 (12), pp. 2126-2134

16.          Z. H. Gan , W. Shao, S. G. Mhaisalkar, Z. Chen, Hongyu Li, K. N. Tu, A. M. Gusak “Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects”, Journal of Materials Research, 2006, Vol. 21 (9), pp. 2241-2245

17.          Y. C. Ee, Z. Chen, S. B. Law, S. Xu, N. L. Yakovlev, D. Lai “Copper diffusion in Ti-Si-N layers formed by inductively coupled plasma implantation”, Applied Surface Science, 2006, Vol. 253 (2), pp. 530-534

18.          A. Kumar , Z. Chen, S. Mhaisalkar, C. C. Wong, P. S. Teo, V. Kripesh “Effect of Ni-P Thickness on Solid-State Interfacial Reactions between Sn-3.5Ag Solder and Electroless Ni-P Metallization on Cu Substrate”, Thin Solid Films, 2006, Vol. 504, pp. 410-415

19.          A. Kumar, Z. Chen “Influence of Solid-State Interfacial Reactions on the Tensile Strength of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joint”, Materials Science and Engineering A,  2006, Vol. 423, pp. 175-179

20.          A. Kumar, M. He, Z. Chen “Barrier Properties of Thin Au/Ni-P Under Bump Metallization for Sn-3.5Ag solder”, Surface & Coatings Technology, 2005, Vol. 198. pp. 283-286

21.          Y. C. Ee, Z. Chen, D. Z. Chi, W. D. Wang, S. Xu, S. B. Law “Barrier Property of TiSiN Films Formed by Low Frequency High Density Inductively Coupled Plasma Process”, Surface & Coatings Technology, 2005, Vol. 198. pp. 291-295

22.          M. He, Z. Chen, G. J. Qi “Mechanical Strength of Thermal Aged Sn-3.5Ag/Ni-P Solder Joints”, Metallurgical and Materials Transactions, 2005, Vol. 36A, pp. 65-75

23.          Z. Chen, M. He, G. Qi “Morphology and Kinetic Study of Interfacial Reaction between SnAg3.5 Solder and Electroless Ni-P Metallization” Journal of Electronic Materials, 2004, Vol. 33, pp. 1465-1472

24.          A. Kumar, M. He, Z. Chen, P. S. Teo “Effect of Electromigration on Interfacial Reactions between Electroless Ni-P and Sn3.5Ag Solder”, Thin Solid Films, 2004, Vol. 462-463, pp. 413-418

25.          M. He, A. Kumar, P. T. Yeo, G. J. Qi, Z. Chen “Interfacial Reaction between Sn-Rich Solders and Ni-Based Metallization”, Thin Solid Films, 2004, Vol. 462, pp. 387-394

26.          M. He, Z. Chen, G. J. Qi, C. C. Wong, S. Mhaisalkar “Effect of Post Reflow Cooling Rate on Intermetallic Compound Formation between Sn-3.5Ag Solder and Ni-P Under Bump Metallization”, Thin Solid Films, 2004, Vol. 462-463, pp. 363-369

27.          M. He, W. H. Lau, G. J. Qi, Z. Chen “Intermetallic Compound Formation between Sn-3.5Ag Solder and Ni-Based Metallization during Liquid State Reaction”, Thin Solid Films, 2004, Vol. 462, pp. 376-383

28.          M. He, Z. Chen, G. Qi “Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization”, Acta Materialia, 2004, Vol. 52, pp. 2047-2056

 

Thin films and surface engineering (PVD/CVD, electrochemical plating, sol-gel coatings, interface enhancement, surface wetting states, etc.)

1.             H. Yan, R. N. Santoso, Y. Y. Jiang, M. H. Liang, Z. Chen “Effect of oxygen concentration on the thermal stability of magnetron sputtered amorphous Ta-Ni thin films”, Thin Solid Films, 2012, Vol. 520, pp. 2356-2361

2.             Y. K. Lai, Y. K. Lai, C. J. Lin, Z. Chen “Extremely Wetting Pattern by Photocatalytic Lithography and Its Application”, Invited book chapter in Recent Advances in Nanofabrication Techniques and Applications (Book Editor: B. Cui), InTech, 2011, pp. 591-614 (ISBN 9789533076027)

3.             Y. K. Lai, Z. Chen, C. J. Lin “Recent progress on the superhydrophobic surfaces with special adhesion: From natural to biomimetic to functional”, Journal of Nanoengineering and Nanomanufacturing, 2011, Vol. 1, pp. 18-34

4.             D. S. R. Krishna, Y. Sun, Z. Chen “Magnetron Sputtered TiO2 Films on Stainless Steel Substrate: Selective Rutile Phase Formation and Its Tribological and Anti-corrosion Performance”, Thin Solid Films, 2011, Vol. 519, pp. 4860-4864

5.             L. Y. L. Wu, S. K. Ngian, Z. Chen, D. T. T. Xuan “Quantitative Test Method for Evaluation of Anti-Fingerprint Property of Coated Surfaces”, Applied Surface Science, 2011, Vol. 257, pp. 2965-2969

6.             X. Z. Ding, X. T. Zeng, X. Y. He, Z. Chen “Tribological properties of Cr- and Ti-doped MoS2 composite coatings under different humidity atmosphere”, Surface & Coatings Technology, 2010, Vol. 205. pp. 224-231

7.             H. Yan, L. Li, F. Y. Ho, M. H. Liang, J. S. Pan, S. Xu, Z. Chen “Formation and characterization of magnetron sputtered Ta-Si-N-O thin films”, Thin Solid Films, 2009, Vol. 517 (17), pp. 5207-5211

8.             Q. Chen, C. Udomsangpetch, S. C. Shen, Y. C. Liu, Z. Chen, X. T. Zeng “The effect of AlOOH boehmite nanorods on mechanical property of hybrid composite coatings”, Thin Solid Films, 2009, Vol. 517 (17), pp. 4871-4874

9.             L. Y. L. Wu, L. Boon, Z. Chen, X. T. Zeng “Adhesion Enhancement of Sol-Gel Coating on Polycarbonate by Heated Impregnation Treatment”, Thin Solid Films, 2009, Vol. 517 (17), pp. 4850-4856

10.         Y. L. Wu, Z. Chen, X. T. Zeng “Nanoscale Morphology for High Hydrophobicity of a Hard Sol-Gel Thin Film”, Applied Surface Science, 2008, Vol. 254, pp. 6952-6958

11.         X. Zhang, K. N. Tu, Z. Chen, Y. K. Tan, C. C. Wong, S. G. Mhaisalkar, X. M. Li, C. H. Tung, C. K. Cheng “Pulse Electroplating of Copper Film: A study of Process and Microstructure”, Journal of Nanoscience and Nanotechnology, 2008, Vol. 8 (5), pp. 2568-2574

12.         X. F. Ang, Z. Chen, C. C. Wong, J. Wei “Effect of Chain Length on Low Temperature Gold-Gold Bonding by Self Assembled Monolayers”, Applied Physics Letters, 31 March 2008, Vol. 92 (13), Art. No. 131913

13.         G. G. Zhang, X. F. Ang, Z. Chen, C. C. Wong, J. Wei “Critical Temperatures in Thermocompression Gold Stud Bonding”, Journal of Applied Physics, 2007, Vol. 102 (6), Art. No. 063519

14.         X. F. Ang, F. Y. Li, W. L. Tan, Z. Chen, C. C. Wong, J. Wei “Self-assembled Monolayers for Reduced Temperature Direct Metal Thermocompression Bonding”, Applied Physics Letters, 8 August 2007, Vol. 91 (5), Art. No. 061913

15.         Q. J. Cheng, J. D. Long, Z. Chen, S. Xu “Chemically active plasmas for deterministic assembly of nanocrystalline SiC film”, Journal of Physics D: Applied Physics, 2007, Vol. 40 (8), pp. 2304-2307

16.         Xi Zhang, Zhong Chen, K. N. Tu “Immersion Nickel Deposition on Blank Silicon in Aqueous Solution Containing Ammonium Fluoride”, Thin Solid Films, 2007, Vol. 515, pp. 4696-4701

17.         Z. H. Gan, Z. Chen, S. G. Mhaisalkar, M. Damayanti, Z. Chen, K. Prasad, S. Zhang, N. Jiang “Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface”, Applied Physics Letters, 5 June 2006, Vol. 88 (23), Art. No. 233510

18.         L. Y. L. Wu, G. H. Tan, X. T. Zeng, T. H. Li, Z. Chen “Synthesis and Characterization of Transparent Hydrophobic Sol-Gel Hard Coatings”, Journal of Sol-Gel Science and Technology, 2006, Vol. 38 (1), pp. 85-89

19.         Y. C. Ee, Z. Chen, T.-M. Lu, Z. L. Dong, S. B. Law “Low temperature physical-chemical vapor deposition of Ti-Si-N-O barrier films”, Electrochemical and Solid State Letters, 2006, Vol. 9 (3), pp. G100-G103

20.         Z. Chen, A. Ng, J. Yi, and X. Chen “Multi-layered Electroless Ni-P Coatings on Powder-Sintered Nd-Fe-B Permanent Magnet”, Journal of Magnetism and Magnetic Materials,  2006, Vol. 302 (1), pp. 216-222

21.         Z. H. Gan, S. G. Mhaisalkar, Z. Chen, Z. Chen, K. Prasad, S. Zhang, M. Damayanti, N. Jiang “Modification of Ta/Polymeric Low-k Interface by Electron Beam Treatment”, Journal of The Electrochemical Society, 2006, Vol. 153, pp. G30-G34

22.         Y. C. Ee, Z. Chen, L. Chan, K. H. See, S. B. Law, S. Xu, Z. L. Tsakadze, P.P. Rutkevych, K. Y. Zeng, L. Shen “Formation of Ti-Si-N film using low frequency, high density inductively coupled plasma process”, Journal of Vacuum Science & Technology B, 2005, Vol. 23, pp. 2444-2448

23.         S. P. Chong, Y. C. Ee, Z. Chen, S. B. Law, “Electroless Copper Seed Layer Deposition on Tantalum Nitride Barrier Film”, Surface & Coatings Technology, 2005, Vol. 198. pp. 287-290

24.         Y. C. Ee, Z. Chen, L. Chan, Alex K. H. See, S. B. Law, K. C. Tee, K. Y. Zeng, L. Shen “Effect of Processing Parameters on Electroless Cu Seed Layer Properties”, Thin Solid Films, 2004, Vol. 462-463, pp. 197-201

25.         Y. C. Ee, Z. Chen, S. Xu, L. Chan, K. H. See, S. B. Law “Electroless Copper Deposition as a Seed Layer on TiSiN Barrier”, Journal of Vacuum Science & Technology A, 2004, Vol. 22, pp. 1852-1856

 

Mechanics & mechanical behaviour (fracture, fatigue, creep, etc. in bulk monolithic & composite materials, thin films, surfaces & interfaces)

1.             L. Shen, W. C. D. Cheong, Y. L. Foo, Z. Chen “Nanoindentation creep of tin and aluminium: A comparative study between constant load and constant strain rate methods”, Materials Science and Engineering A, 2012, Vol. 532, pp. 505-510

2.             K. Mohan, T. H. Yip, S. Idapalapati, Z. Chen “Impact response of aluminum foam core sandwich structures”, Materials Science and Engineering A, 2011, Vol. 259, pp. 94-101

3.             S. Z. Y. Loo, P. C. Lee, Z. X. Lim, N. Yantara, T. Y. Tee, C. M. Tan, Z. Chen “Interface fracture toughness assessment of solder joints using double cantilever beam test”, International Journal of Modern Physics B, 2010, Vol. 24 (1-2), pp. 164-174

4.             Z. Chen, L. Y. L. Wu, E. Chwa, O. Tham “Scratch Resistance of Brittle Thin Films on Compliant Substrates”, Materials Science and Engineering A, 2008, Vol. 493, pp. 292-298

5.             L. Y. L. Wu, E. Chwa, Z. Chen, X. T. Zeng “A Study Towards Improving Mechanical Properties of Sol-Gel Coatings for Polycarbonate”, Thin Solid Films, 2008, Vol. 516 (6), pp. 1056-1062

6.             Z. Chen, Z. H. Gan “Fracture Toughness Measurement of Thin Films on Compliant Substrate Using Controlled Buckling Test”, Thin Solid Films, 2007, Vol. 515, pp. 3305–3309

7.             Z. Chen, M. He, B. Balakrisnan, C. C. Chum “Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films”, Materials Science and Engineering A, 2006, Vol. 423, pp. 107-110

8.             Z. H. Gan, S. Mhaisalkar, Z. Chen, S. Zhang, Z. Chen, K. Prasad, “Study of Interfacial Adhesion Energy of Multi-layered ULSI Thin Film Structures Using Four-point Bending Test”, Surface & Coatings Technology, 2005, Vol. 198. pp. 85-89

9.             B. Balakrisnan, C. C. Chum, M. Li, Z. Chen, T. Cahyadi "Fracture toughness of Cu-Sn intermetallic thin films", Journal of Electronic Materials, 2003, Vol. 167, pp. 170-176 

10.         B. Cotterell, Z. Chen, J. B. Han, N. X. Tan "The Strength of the Silicon Die in Flip Chip Assemblies", Journal of Electronic Packaging, 2003, Vol. 125, 114-119 (We apologize that Fig. 5 in the original article was misprinted. Please click here for the correct figure)

11.         A. G. Atkins, Z. Chen, B. Cotterell "Prediction of the Energy Dissipation Rate in Ductile Crack Propagation", Fatigue & Fracture of Engineering Materials & Structures, 2003, Vol. 26, pp. 67-77

12.         Z. Chen, X. Xu, C. C. Wong, S. Mhaisalkar "Effect of Plating Parameters on the Intrinsic Stress in Electroless Nickel Plating", Surface & Coatings Technology, 2003, Vol. 167, pp. 170-176

13.         Z. Chen “The Root Angle in Elastoplastic Peeling Tests”, Key Engineering Materials, 2002, Vol. 227, pp. 41-48

14.         Z. Chen, B. Cotterell, W. Wang "The Fracture of Brittle Thin Films on Compliant Substrate in Flexible Displays" Engineering Fracture Mechanics, 2002, Vol. 69, pp. 597-603

15.         Z. Chen, B. Cotterell, W. Wang, E. Guenther, S. J. Chua "A Mechanical Assessment of Flexible Opto-electronic Devices", Thin Solid Films, 2001, Vol. 394, pp. 202-206

16.         B. Cotterell, Z. Chen "Buckling and Cracking of Thin Films on Compliant Substrate under Compression", International Journal of Fracture, 2000, Vol. 104, pp. 169-179

17.         Z. Chen, B. Cotterell, W. T. Chen "Characterizing the Interfacial Fracture Toughness for Microelectronic Packaging" Surface and Interface Analysis, 1999, Vol. 28, pp. 146-149

18.         A. G. Atkins, Z. Chen, B. Cotterell "The Essential Work of Fracture and JR Curves for the Double Cantilever Beam Specimen: An Examination of Elastoplastic Crack Propagation" Proceedings of The Royal Society of London, 1998, Vol. A454, pp. 815-833

19.         B. Cotterell, Z. Chen "The Blister Test – Transition from Plate to Membrane Behaviour for an Elastic Material" International Journal of Fracture, 1997, Vol. 86, pp. 191-198